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Monday March 18, 7:45 am Eastern Time
Press Release
biz.yahoo.com
SOURCE: SpeedFam-IPEC, Inc.
SpeedFam-IPEC's 300-mm CMP Tool Selected for Copper/Ultra Low-k Development in Japan
Semiconductor Consortium Expands Process R&D at 0.10 - 0.07 um with Momentum300 Orbital Hard-Platen Technology
CHANDLER, Ariz.--(BUSINESS WIRE)--March 18, 2002-- SpeedFam-IPEC, Inc. (Nasdaq:SFAM - news), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, has announced that a Japan-based technology consortium has placed an order for the company's 300-mm CMP system, Momentum300(TM). Scheduled for shipment next month, Momentum300 will be used for copper and ultra low-k research and development at and below 0.10-micron technology nodes.
More than 20 Momentum-based CMP tools are currently on order or installed in the United States, Europe and Asia. The 300-mm system, slated for purchase by the semiconductor consortium, will be the first implementation of orbital hard-platen polishing technology in Japan. The tool placement advances SpeedFam-IPEC's global account penetration program for Momentum-based systems.
SpeedFam-IPEC President and CEO Richard Faubert said, ``We have committed to securing six 200-mm and three 300-mm Momentum evaluations at top-ranking device manufacturers' sites during the current industry downturn. This order represents a strategic showcase for Momentum300's superior process capabilities and cost of ownership benefits because consortium members are influential manufacturers with a broad base among top Japanese chipmakers.''
Faubert added, ``They selected Momentum300 after reviewing the results of stringent, head-to-head demonstrations by our company and other CMP equipment suppliers. Momentum offers a competitive edge when polishing advanced copper wafers. Momentum advantages become even more important as customers move to low-k dielectrics. These delicate, often porous, films benefit from Momentum's ability to polish at low pressure. Undoubtedly, the consortium is assessing advanced technologies today so that its members may quickly and effectively meet the increased production demands of tomorrow's complex devices at the coming upturn.''
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With more than 1,300 CMP systems installed worldwide, the company enables the development of next-generation integrated circuit technology through its leading-edge polishing systems. SpeedFam-IPEC also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on Nasdaq under the symbol SFAM. The company's web site URL is www.sfamipec.com.
This press release includes statements that constitute ``forward-looking statements'' within the meaning of the Private Securities Litigation Reform Act of 1995 (the ``Reform Act'') and SpeedFam-IPEC claims the protection of the safe-harbor for forward-looking statements contained in the Reform Act. These forward-looking statements are often characterized by the terms ``may,'' ``believes,'' ``projects,'' ``expects,'' or ``anticipates,'' and do not reflect historical facts. Specific forward-looking statements contained in this press release include, but are not limited to: (i) SpeedFam-IPEC's commitment to securing a number of product evaluations at top-ranking device manufacturers' sites during the industry downturn; (ii) SpeedFam-IPEC's belief that Momentum provides superior process capabilities and cost of ownership benefits; (iii) SpeedFam-IPEC's belief that Momentum offers a competitive edge when polishing copper wafers and low-k dielectric; and (iv) SpeedFam-IPEC's belief that there will be an upturn in the semiconductor industry.
Forward-looking statements involve risks, uncertainties and other factors that may cause actual results, performance or achievements of SpeedFam-IPEC to be materially different from those expressed or implied by such forward-looking statements. Factors that could affect SpeedFam-IPEC's results and cause them to materially differ from those contained in the forward-looking statements include risks set forth in SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001 and the Quarterly Report on Form 10-Q filed on January 11, 2002 and include (i) current depressed market conditions in the semiconductor industry; (ii) SpeedFam-IPEC's ability to preserve its capital reserves, and raise or generate sufficient capital to fund operations beyond the current fiscal year; (iii) the possible significant dilution of the Company's outstanding common stock in connection with any new financing or refinancing; (iv) the ultimate success of SpeedFam-IPEC's business model, which is highly predicated on the successful market acceptance of its Momentum(TM) and Momentum300(TM) products. Sales of Momentum(TM) may not occur on the scale or in the time frame anticipated; (v) possible constraints on the roll-out of Momentum(TM) tools due to manufacturing problems, unforeseen technical problems or changes in the CMP marketplace that differ from the company's expectations; (vi) SpeedFam-IPEC's dependence on selling a small number of high-priced machines to a small number of major customers; (vii) intense competition from companies with greater resources; (viii) prospects of, and risks related to, international markets and global economy, given that SpeedFam-IPEC depends heavily on international sales; and (ix) other factors that SpeedFam-IPEC is currently unable to identify or quantify, but may exist in the future.
Forward-looking statements speak only as of the date the statement was made. SpeedFam-IPEC does not undertake and specifically declines any obligation to update any forward-looking statements. |
