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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 216.00-0.7%Dec 4 3:59 PM EST

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To: Yousef who wrote (75588)3/26/2002 9:47:55 AM
From: ElmerRead Replies (2) of 275872
 
Thanks Yousef for your comments. I would add that the defect density number is measured at wafer sort and is primarily based on particulates. Assuming proper process control (not the 20 Sigma suggested by TWY<G>) the parametric failures shouldn't be a significant issue and aren't best screened at WS anyway. The single stuck@ fault model is the primary metric for screening at WS which is used for calculating defect density and best describes particulates, while any remaining parametric failures are caught at final test, hopefully at elevated temp.

It's hard for people to grasp that 50% yield could be much better than 75% yield if the die sizes aren't the same. Eventually they'll realize what is meant by bad yields.

EP
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