Asyst claims major advancements in new 300-mm wafer load port
New system makes wafers available to tool in eight seconds after arrival
URL: siliconstrategies.com
FREMONT, Calif.--Asyst Technologies Inc. today unveiled its next-generation 300-mm load port product, which the company said breaks new ground in automated wafer handling for front-opening-unified-pod (FOUP) interfaces on fab equipment.
Asyst said its new IsoPort 300-mm wafer load port has been designed to give semiconductor tool original equipment manufacturers (OEMs) a highly configurable solution for integration with systems. The new FOUP load port improves performance with new servo-controlled motion, a smart latchkey design and optimized carrier sensing systems, Asyst said.
Tool throughput has been enhanced, with the time from wafer carrier arrival to first-wafer access at eight seconds, the company said. Contamination control has been pushed to Class 1 particle level.
The Fremont-based mini-environment supplier said it is aiming the new load-port at a market that's expected to grow at 50% per year as 300-mm fabs move into production. Asyst claims it currently has a 50% market share in the 300-mm load ports. In the FOUPs arena, Asyst's main competition comes from Brooks Automation Inc., which is merging with PRI Automation to expand its systems portfolio (see March 4 story).
Asyst's IsoPort 300-mm load port is currently in beta-site testing. Production shipments are slated to begin in July.
"As the 300-mm market continues to ramp, our OEM [tool] customers are looking for highly configurable, reliable, low cost-of-ownership solutions that will enable them to provide easily integrated, complete automation solutions to meet end-users' requirements," said Jon Sabol, vice president of Asyst's Equipment Solutions Group. "We worked closely with leading OEMs to develop an innovative, custom-configurable load port design that would deliver best-in-class interoperability and cleanliness, together with full industry-spec compliance. Our new IsoPort is the result."
In the new IsoPort load port contamination control performance has been extended to the ISO Class 1 particle level, which eliminates triboelectric charge buildup on the carrier door in the laminar flow path while in the open position, said Asyst. The IsoPort also features optional gas purge ports that provide an inert ambient environment for wafers in the carrier on the load port. Asyst said the product's materials are resistant to corrosion from reactive process gases.
Compared to previous-generation products, IsoPort requires "zero" preventive maintenance, and adjustments have been simplified and/or eliminated, according to Asyst. |
