Formerly About Applied Materials Message Board

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Politics : Formerly About Applied Materials

AMAT 322.34

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Jan 23 9:30 AM EST

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To: Kirk © who wrote (62836)	4/11/2002 12:55:30 PM
From: Gottfried	Read Replies (1) of 70976

Chip foundries push up wafer plans news.com.com By John G. Spooner Staff Writer, CNET News.com April 11, 2002, 8:50 AM PT Two of the world's largest semiconductor foundries are speeding up their plans to produce chips on 300-millimeter wafers. Taiwan Semiconductor Manufacturing (TSMC) and United Microelectronics (UMC) have each moved up plans to open new fabrication plants by several months. UMC said Thursday that it would begin production on 300-millimeter wafers in its newest fabrication plant, a joint venture with DRAM maker Infineon, in the second quarter of 2003, months earlier than previously planned. [snip]

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