Monica, Fab 30 NEVER actually had a capacity of 6,000 WSPW.
Showing a 1997 quote that said it was theoretically possible
does not mean that it ever happened. The tools that are in Fab
30 now didn't even exist back then. It was an estimate. Which
means that your claim that AMD's 9-layer process had reduced
the capacity of the fab is baseless.
And I repeat from the annual report:
Wafer Approximate
Size Production Clean Room
(Diameter Technology (Square
Facility Location in Inches) (in Microns) Footage)
----------------- ---------- ------------ -----------
Austin, Texas
Fab 25......................... 8 0.18 120,000
Fabs 14 and 15................. 6 0.5 42,000
Aizu-Wakamatsu, Japan
FASL JV1/(1)/.................. 8 0.35 70,000
FASL JV2/(1)/.................. 8 0.25 & 0.35 91,000
FASL JV3/(1)/.................. 8 0.17 118,000
Dresden, Germany
Fab 30......................... 8 0.18 115,100
Fab 25 is larger than Fab 30, it has used five layer and six layer metal
processes, and it has NEVER had a capacity larger than 5,000 WPW.
Petz |
