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Politics : Formerly About Applied Materials

AMAT 322.51

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Feb 6 9:30 AM EST

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To: StanX Long who wrote (63000)	4/19/2002 1:40:27 AM
From: StanX Long	Read Replies (1) of 70976

Taiwan Winbond:Ends Tech Development Pact With Fujitsu,Toshiba Friday April 19, 12:11 am Eastern Time biz.yahoo.com TAIPEI -(Dow Jones)- Winbond Electronics Inc. (Q.WBE), a memory chip producer, said Friday it is ending a technology development and transfer pact with Japan 's Toshiba Corp. (J.TOS) and Fujitsu Ltd. (J.FUT). The reason is because Toshiba last year announced it was pulling out of the dynamic random access memory chip market, Winbond said in a filing with the Taiwan Stock Exchange. Winbond and the Japanese companies had announced an alliance in 2000 for developing next-generation DRAM devices. All three companies agreed to end the pact, Winbond said. Toshiba last year said it would withdraw from the commodity-grade DRAM business by selling related assets to Micron Technology (NYSE: MU - news) Inc. (MU). Winbond has scheduled a press conference at 0600 GMT ( 2:00 a.m. EDT) at the stock exchange to give further details. (This story was originally published by Dow Jones Newswires) Copyright (c) 2002 Dow Jones & Company, Inc. All Rights Reserved

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