Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 263.16

+3.7%

10:04 AM EST

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To: Joe NYC who wrote (77890)	4/22/2002 12:22:18 AM
From: Mani1	Read Replies (3) of 275872

Joe, re <<What are the advantages, and can it be quantified?>> The biggest advantage, as you mentioned, is the mechanical protection of the die, specially when assembly is done by not so expert screw driver shops. The cost is the biggest disadvantage. You need to add a dispenser, a pick and place and an oven to your assembly line. It can also carry a thermal disadvantage. The best thermal solution is if the die goes directly to a heat spreader/heat sink combo. Re <<- larger contact area with heat sink, helps conductivity. But isn't there some loss in conductivity from the silicon to integrated heat spreader that offests it?>> Yes, larger contact area is not really an advantage. Because you are effectively adding a new resister in your thermal circuit. Mani

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