Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 259.52

+2.3%

3:01 PM EST

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To: tcmay who wrote (77905)	4/22/2002 1:53:48 AM
From: Mani1	Read Replies (1) of 275872

Re <<No, you have it backwards. >> No I don't. You misunderstood what I said. Or intentionally misinterpret it. Bigger contact area is better as heat flow is proportional to the area. But in order to get this bigger contact area, heat has to get through an extra path (die to heat slug). All things being equal, it is better to go straight from the die to the heatsink / heat spreader combo. It is not as good to go through a heat slug (such as the one intel uses and AMD plans to use with hammer) then to heatsink/heat spreader combo. That heat slug which is only a few times the size of the die is there for mechanical protection. Re <<No one is talking about adding more series links>> What? Having the heat slug on the die is a series link. Re <<To see this, switch from thinking of resistance and instead think of its inverse form, conductivity. (Or go ahead and compute the form 1/R = 1/ (1/R1 + 1/R2 + ...).)>> I know this, so should anyone who has taken heat transfer 101. Your ignorance stems from your lack of knowledge in back end packaging. Mani

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