Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 259.65

+2.3%

3:59 PM EST

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To: Mani1 who wrote (77899)	4/23/2002 7:13:41 AM
From: Bill Jackson	Read Replies (2) of 275872

Mani, >>Yes, larger contact area is not really an advantage. Because you are effectively adding a new resister in your thermal circuit.>> I think you are replacing the initial gradient from die to the traditional heat sink through thermal compound with a lower thermal resistance to the header(copper?). This gradient will be less steep, less delta T at the interface, and thus the spreader will be able to remove more heat than the heat sink to die method. Of course you then need a heat sink to the spreader. Since this spreader is made very flat, like the heat sink, and it is also a lot stronger than the die you will be able to squeeze the thermal paste into a much thinner layer by adding force that might break the die if used on a naked die. Thus we have another low thermal path. These two replace the fragile direct to die heat sink and is a lower thermal R path than the direct to die one. One assumes that the spreader/heatsink are matched to make sure this works well. Ever see and alphas? 2 bolts to attach the HS to the header. The two bolts and tight fitting holes prevent torque transfer when right tool is used to tighten them. Bill

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