tcmay re...Looking at several designs, including the URL I gave, and also Intel's PIII/P4 descriptions, it's clear that heat spreaders and slugs are used to make contact to the rest of the package. Obviously so, but it bears repeating.<<<
I tried but the URL didn't pop up, so I didn't read it.
To increase the heat flow, the man places a 1-foot by 6-foot metal plate on the bench and then sits down on that. The metal plate is an excellent lateral (and isotropic) conductor of heat. Being that it makes contact with the wooden bench over much more area than the man's butt, it drains heat out of the man with amazing efficiency.<<<<<
Perhaps I am thinking wrong. When we are talking metal spreaders, what kind of metal are we talking about? I always assumed they were simple iron, but then your analogy about the wooden bench would be ass backwards, (pun intended), as the aluminum or copper heat sinks would be more conductive than a metal spreader. I am probably out of my league here, as most of my knowledge here is from car radiators. Yes your parallelism is important, as a bigger radiator can disperse more heat, but Mani's point is also important, as I know the thinner the wall, the better the conductivity between air and coolant. I will try your URL again to see if I can bone up on the subject. Thanks. |
