Leading Taiwan Device Manufacturer Bolsters Production Capacity With SpeedFam-IPEC CMP Tool Orders
Chipmaker Accepts Momentum Technology for 0.10 micron Copper/Low k Development, Expands Commitment to Orbital, Hard-Platen CMP for 0.13 micron Copper Production
CHANDLER, Ariz.--(BUSINESS WIRE)--May 16, 2002-- SpeedFam-IPEC, Inc. (Nasdaq:SFAM - News), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, has announced that its 200-mm Momentum(TM) system has been accepted by a leading Taiwan-based chip manufacturer for copper/low k process development at the 0.13- and 0.10-micron technology nodes. The Taiwan chipmaker also has selected Momentum for copper wafer production at the 0.18- and 0.13-micron nodes. Further, the device manufacturer has placed a multi-unit CMP equipment order with SpeedFam-IPEC to extend its production capacity for copper and tungsten 200-mm wafer manufacturing. The orbital, hard-platen polishing tools were selected based on Momentum's unique cost of ownership and productivity advantages for copper wafer production at and below 0.13 micron.
With nearly 30 Momentum-based CMP tools currently on order or installed in the United States, Europe and Asia, these most recent orders demonstrate the growing success of SpeedFam-IPEC's global account penetration goals set for Momentum last year.
SpeedFam-IPEC President and CEO Richard Faubert said, "We have been committed to securing six 200-mm and three 300-mm Momentum evaluations at top-ranking device manufacturers' sites during the current industry downturn, and we have far surpassed this goal."
He added, "Post-evaluation orders such as these are illustrative of device manufacturers' confidence in Momentum for production manufacturing. Our Taiwan customer is a world-leading foundry that manufactures advanced process integrated circuits for applications spanning every major sector of the semiconductor industry. They made a commitment to Momentum technology for copper applications after reviewing results gathered during months of rigorous process development runs in their fabrication facilities. Once again, Momentum has demonstrated superior copper process capability, has proven its flexible and wide process window and has delivered attractive cost of ownership benefits."
Faubert concluded, "Our customer's commitment to Momentum technology in production is testimony to the advantages of the platform's unique total wafer metrics control capabilities. Momentum consistently offers a competitive edge when it comes to repeatability, technological extendibility, process flexibility and wafer profile tuneability."
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With more than 1,300 CMP systems installed worldwide, the company enables the development of next-generation integrated circuit technology through its leading-edge polishing systems. SpeedFam-IPEC also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on Nasdaq under the symbol SFAM. The company's web site URL is www.sfamipec.com.
This press release includes statements that constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Reform Act") and SpeedFam-IPEC claims the protection of the safe-harbor for forward-looking statements contained in the Reform Act. These forward-looking statements are often characterized by the terms "may," "believes," "projects," "expects," or "anticipates," and do not reflect historical facts. Specific forward-looking statements contained in this press release include, but are not limited to: (i) SpeedFam-IPEC's assertion that it is on track to meet or exceed its 300mm objectives; (ii) SpeedFam-IPEC's assertion that post evaluation orders are illustrative of device manufacturers confidence in Momentum for production manufacturing and (iii) SpeedFam-IPEC's assertion that Momentum consistently offers a competitive edge.
Forward-looking statements involve risks, uncertainties and other factors that may cause actual results, performance or achievements of SpeedFam-IPEC to be materially different from those expressed or implied by such forward-looking statements. Factors that could affect SpeedFam-IPEC's results and cause them to materially differ from those contained in the forward-looking statements include risks set forth in SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001 and the Quarterly Report on Form 10-Q filed on April 10, 2002 and include (i) current depressed market conditions in the semiconductor industry; (ii) SpeedFam-IPEC's ability to preserve its capital reserves, and raise or generate sufficient capital to fund operations; (iii) the possible significant dilution of the Company's outstanding common stock in connection with any new financing or refinancing; (iv) the ultimate success of SpeedFam-IPEC's business model, which is highly predicated on the successful market acceptance of its Momentum and Momentum300 products. Sales of Momentum may not occur on the scale or in the time frame anticipated; (v) possible constraints on the roll-out of Momentum tools due to manufacturing problems, unforeseen technical problems or changes in the CMP marketplace that differ from the company's expectations; (vi) SpeedFam-IPEC's dependence on selling a small number of high-priced machines to a small number of major customers; (vii) intense competition from companies with greater resources; (viii) prospects of, and risks related to, international markets and global economy, given that SpeedFam-IPEC depends heavily on international sales; and (ix) other factors that SpeedFam-IPEC is currently unable to identify or quantify, but may exist in the future.
Forward-looking statements speak only as of the date the statement was made. SpeedFam-IPEC does not undertake and specifically declines any obligation to update any forward-looking statements. |
