Amkor Goes Green with CSP Packages
Online staff -- Electronic News, 5/22/2002
Amkor Technology Inc. has officially gone "green" with its packaging materials. The company today claimed to be the first contract semiconductor packaging company to exceed environmental requirements for green packages by qualifying its entire chip scale package (CSP) portfolio without using lead- and halide-based materials.
Chandler, Ariz.-based Amkor claims to have the industry’s largest CSP product portfolio, including single die packages, multi-chip and stacked packages, and advanced CSP packages. Amkor said it has met the objectives of the Strategic Design for Environment (DfE) initiatives more than five years ahead of some proposed timetables.
"As consumer electronics evolve faster, product obsolescence and disposal will become a larger concern," said Jim Fusaro, Amkor’s VP of CSP products, in a statement. "Amkor is focused on offering solutions that eliminate potential environmental concerns while providing increased reliability and performance across the entire package family."
Amkor’s CSP portfolio meets OEM, and European, North American and Asian consortia initiatives designed to reduce negative environmental effects during disposal, including the World Business Council for Sustainable Development, the National Center for Manufacturing Sciences, and the European directive on Waste Electrical and Electronic Equipment. |
