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Politics : Formerly About Applied Materials

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To: StanX Long who wrote (63989)	5/24/2002 2:33:17 AM
From: StanX Long	Read Replies (1) of 70976

Fab utilization up at 76% in Q1 as capacity slips slightly, says SIA By J. Robert Lineback Semiconductor Business News (05/23/02 08:58 a.m. EST) siliconstrategies.com SAN JOSE -- Worldwide wafer fab capacity utilization climbed to 76.3% in the first quarter of 2002 from 65.9% in Q4 of 2001 as chip makers continued to mothball mostly 0.25-micron manufacturing lines at the start of this year, said a new report released by the Semiconductor Industry Association (SIA) here. The new quarterly Semiconductor International Capacity Statistics (SICAS) report said the industry's IC fabs were equipped to fabricate 1.27 million eight-inch equivalent wafers per week in the first quarter vs. 1.28 million in the final quarter of 2001. The SICAS report underscores the industry's growng shortage of capacity for leading-edge IC processes. Capacity utilization of advanced processes with feature sizes below 0.2-micron (including the 0.18- and 0.13-micron technology nodes) grew to 90% in the first quarter from 83.5% in Q4, the report said. A year earlier in the first quarter of 2001, those advanced fab lines were operating at only 81% capacity. The IC industry has been steadily decreasing its installed based of wafer fab capacity since the third quarter of 2001, when plants were tooled up to process 1.32 million eight-inch equivalent wafers per week, according to the report. The first-quarter 2002 installed IC fab capacity level was 4.1% lower than it was in Q3 last year.

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