FSI Wins 300-mm Multi-System Follow-On Orders From Leading U.S. Semiconductor Manufacturer
MINNEAPOLIS--(BUSINESS WIRE)--May 29, 2002--FSI International, Inc. (Nasdaq:FSII - News) today announced it has received follow-on orders of approximately $15 million for its ZETA® 300-mm Surface Conditioning Systems and POLARIS® 3500 Microlithography Clusters. This equipment will be installed at a major U.S. semiconductor manufacturer to support its 300-mm production ramp.
"Receiving this customer's follow-on order further demonstrates the maturity and advantages of FSI's 300-mm capabilities. Our cleaning and resist processing systems, which have delivered excellent results, are enabling this customer to quickly ramp up as 300-mm production demands increase," said Don Mitchell, chief executive officer of FSI International. "FSI's strength in 300-mm is unquestionable: the ZETA and POLARIS systems are the tools of record for this customer's production line, and we have a growing installed base of 300-mm products in operation at production facilities worldwide. This market lead serves FSI well as we look ahead to supporting the growing demand for 300-mm capabilities throughout the industry."
The customer will use FSI's ZETA 300-mm Surface Conditioning Systems for front-end-of-line (FEOL) photoresist and cobalt stripping; the POLARIS 3500 Microlithography Clusters will be used for all the fab's resist processing applications. Tool shipments are expected to begin in FSI's fourth quarter fiscal 2002, which began on May 26.
The ZETA 300 System provides the most advanced surface conditioning process control available through a combination of features, including a single closed nitrogen-purged chamber, temperature and flow-compensated chemical processing and an on-board diagnostic system. Providing high-productivity process solutions for both FEOL and BEOL strip, etch and clean applications, the ZETA 300 platform ranges in price from $2.0 million to $3.0 million depending on the model and configuration.
The POLARIS 3500 Microlithography Cluster extends the unique productivity benefits of the POLARIS Cluster platform to 300-mm wafer processing. The tool is targeted at 0.10-micron design rule applications. With the industry's current shift to 300-mm chip production, the POLARIS 3500 system has further tightened process control, while continuing to push wafer throughput efficiency. The POLARIS Cluster ranges in price from $2.0 million to $3.5 million depending on the model and its configuration.
FSI International Inc., a global supplier of wafer cleaning and resist processing equipment and technology, delivers economic and technical advantages for current and emerging microelectronics manufacturing challenges. Using the company's broad portfolio of products, which include immersion, spray, vapor and CryoKinetic systems for wafer cleaning, and resist processing systems for wafer coating and developing, customers are able to efficiently achieve their goals. FSI's customers include microelectronics manufacturers located throughout North America, Europe, Japan and the Asia-Pacific region.
FSI maintains a Web site at www.fsi-intl.com.
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FSI International, Inc., Minneapolis
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