Asyst Names Daniel E. Hoffman as Vice President, Manufacturing
FREMONT, Calif.--(BUSINESS WIRE)--June 13, 2002--Asyst Technologies, Inc. (Nasdaq:ASYT - News), a leading provider of integrated automation solutions that maximize semiconductor manufacturing productivity, today announced that it has named Daniel E. Hoffman to the position of Vice President, Fab Solutions Operations, reporting to Fred Tiso, Senior Vice President, Manufacturing Operations.
Hoffman, who has over 14 years of experience in high technology manufacturing, was most recently vice president, surface mount platform systems/operations, for Universal Instruments Corporation (UIC), where he led volume manufacturing for their flagship SMT equipment products. His achievements there included the implementation of lean manufacturing, improvement of supply chain productivity, and high growth performance. He reduced factory work-in-process by nearly 70% while increasing output two-fold. Subsequent lead times were reduced by more than 80%, all while driving a 71% increase in business unit revenues.
Prior to joining UIC, Hoffman was vice president, operations, for the Advanced Substrate Technology and Interconnects business unit of Honeywell Electronic Materials (formerly AlliedSignal EM), where he established start-up operations, implemented 6-sigma initiatives and led key acquisition integration efforts. Hoffman received a bachelor of science degree in chemistry/biochemistry from Eastern Washington University.
About Asyst: Asyst Technologies, Inc. is a leading provider of integrated automation solutions that enable semiconductor manufacturers to increase manufacturing productivity and protect investments in silicon wafers during the manufacture of integrated circuits, or ICs. The company offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between process equipment and the fab line throughout the IC fabrication process, while reducing IC damage caused by human, environmental, mechanical and chemical factors. Encompassing isolation systems, work-in-process materials management, substrate-handling robotics, automated transport and loading systems, and connectivity automation software, Asyst's modular, interoperable solutions allow chipmakers and original equipment manufacturers, or OEMs, to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs. Asyst's homepage is asyst.com.
Safe Harbor: Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to, general economic conditions, semiconductor industry cycles, risks associated with the acceptance of new products and product capabilities and other factors more fully detailed in the Company's recent 10Q quarterly report on file with the Securities and Exchange Commission.
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Contact:
Asyst Technologies, Inc.
John Swenson, 510/661-5000
jswenson@asyst.com
or
Guerrant Associates
Laura Guerrant, 808/882-1467
lguerrant@guerrantir.com |
