yesterday at SEMICON West -- here's the program description for a presentation involving a senior IBIS engineer, Michael Alles. See
semi.org
SEMICON West 97
Silicon-On-Insulator (SOI) Processing Technology
Monday, July 14 8:15 am - 12:30 pm
San Francisco Marriott
Golden Gate A1
Attendees/Visitors | Programs/Events | Registration | Information on Exhibiting | Travel
In this symposium, various topics associated with SOI process technologies and SOI economics will
be discussed.
Silicon-On-Insulator (SOI) technology is regarded as a method to extend the performance
improvement of Si technology in addition to that afforded by direct scaling. The performance
improvement is a result of the reduction of parasitic capacitance to the substrate and the presence of
the floating body during the switching transient.
In addition to performance improvement, SOI allows for a simpler process flow and perhaps even a
smaller die size with accompanying improvements in yields. The combined advantages of improved
performance, lower integrated processing cost, and a potential transparency to bulk device and
circuit design, make SOI a possible replacement for bulk Si substrates in an existing silicon line.
However, for this replacement to happen, significant progress in the development of the SOI
materials' infrastructure is necessary. Since the second half of 1996, a substantial number of major
device manufacturers in USA and Japan have announced their plan to fabricate state-of-the-art
integrated circuits using SOI wafers.
Program Co-Chairs: Sookap Hahn, Ph.D., Pacrim Technology Company and Tohru Hara, Ph.D.,
Hosei University
Agenda
Strategic Directions and Challenges for CMOS Manufacturing on Silicon-On-Insulator (SOI)
Substrates: Materials, Device and Process Integration Issues for 0.18 Micron and Beyond
Dr. P.K. Vasudev, SEMATECH
Market Acceptance of SOI Materials
Dr. Robert A. Craven, SiBond, L.I.C.
200 mm SOI Wafers Using the Smart Cut Technology
Dr. A.J. Auberton-Herve, SOITEC S.A.
New SOI Epi Wafer - ELTRAN
Dr. Takao Yonchara, Canon, Inc.
Developments in SIMOX-SOI Materials and Manufacturing
Michael Alles, Ibis Technology Corporation
Applications of Bonded SOI to Ultra-High-Speed BICMOS LSIs
Takahide Ikeda, Hitachi, Ltd.
Recent Advances on SIMOX CMOS Process Technology for High Speed/Low Power Circuits
Keizo Sakiyama, Sharp Corporation
Fully-Depleted CMOS/SIMOX Technology for Low-Power, High-Speed ULSIs
Toshiaki Tsuchiya, NTT
Who Should Attend: Executive management, sales/marketing personnel, design, manufacturing, R
& D, process engineers, and suppliers of equipment and materials, especially those connected with
materials technology. |
