FSI Enters Automated Immersion Cleaning Market With Launch of MAGELLAN 300 STG Immersion Clean System
Customer-Driven Design for 300-mm Processing at Sub-100-nm Technology Node and Beyond, MAGELLAN(TM) System Combines High Performance with Productivity and Versatility
MINNEAPOLIS--(BUSINESS WIRE)--June 24, 2002-- Leveraging nearly 30 years of wafer-cleaning experience, FSI International, Inc. (Nasdaq:FSII - News) today entered the market for automated immersion cleaning with the introduction of its MAGELLAN(TM) 300 STG® Immersion Clean System. Building on currently available industry leading immersion products with an innovative application of the unique chemical blending and delivery inherent in its spray processing products, the new MAGELLAN System uses a proprietary approach that directly addresses its customers' 300-mm manufacturing needs. Providing high performance at the 100-nm technology node and beyond, this new system is also designed to aid customers as they transition from high volume/low product mix manufacturing to the variable volume/high product mix model. The MAGELLAN System extends the capabilities of immersion cleaning to provide traditional high throughput processing--as high as 30 wph/square meters--as well as cycle time reduction of up to 40 percent. Additionally, this fully automated immersion cleaning solution offers superior process performance, greater versatility and a smaller footprint than existing immersion cleaning tools available on the market, while maintaining proven process chemistries for ease of customer implementation.
"Immersion products are used for at least 50 percent of the cleaning steps within the overall wafer cleaning market. The introduction of this new product opens up a $1 billion per year new business opportunity for FSI," said Don Mitchell, chairman and chief executive officer of FSI. "Coupled with industry analysts' forecasts that IC makers' investments in 300-mm equipment are expected to rise rapidly to greater than 50 percent of total equipment expenditures in 2003, the introduction of the MAGELLAN System strategically positions FSI for this growth opportunity in the most significant segment of the wafer-cleaning market."
Cycle time is reduced by up to 40 percent on the MAGELLAN System through the implementation of efficient processing chemistries and methodologies, such as dilute and ozone chemistries and chemical injection. The shorter cycle time leads directly to reduced learning cycles and faster order turn-around for customers, all of which can have a significant positive impact on their bottom line.
FSI's proprietary chemical blending and delivery technology represents a breakthrough in versatility for immersion cleaning by allowing users to switch between multiple chemistries on the same system with no downtime, thus enabling them to manage a large, changing product mix easily.
FSI's proprietary STG (Surface Tension Gradient) technology, obtained when the Company acquired YieldUP International in 1999, provides high performance, watermark-free rinse/dry with a short, low-IPA consumption process. The incorporation of APC (advanced process control) features further enhances process consistency on the system. World-class etch uniformity and particle removal results have been demonstrated on the MAGELLAN System. For example, the system's patent-pending SymFlow(TM) technology results in 2 angstrom or less range in on-wafer etch non-uniformity for 30 angstrom etch performed in the STG rinse/dry tank.
The footprint of the MAGELLAN System, depending on the configuration, is up to 40 percent smaller than competing tools, with a two-process module configuration of only 7 square meters. This was accomplished through the patented, space-saving automation layout and use of fewer process tanks, based on single-pass dilute chemistry and chemical injection.
"We have selectively combined the best spray attributes, specifically shorter cycle time, versatility and smaller footprint, with the best of immersion cleaning, namely, excellent performance for HF-last chemistries and high throughput, in the design of the MAGELLAN System," said John Ely, president of FSI's Surface Conditioning Division.
The fully-automated MAGELLAN System offers half-pitch, cassetteless processing of up to 52 wafers per batch. Chemistries offered include conventional recirculated concentrated chemistries, as well as advanced single-pass dilute and ozone chemistries. STG rinse/dry technology with chemical injection is standard. The modular system is highly configurable, enabling the user to select the type and number of process modules.
The MAGELLAN System is currently available for shipping at a price range of $2.0 to $3.5 million, depending on the configuration.
FSI International Inc., a global supplier of wafer cleaning and resist processing equipment and technology, delivers economic and technical advantages for current and emerging microelectronics manufacturing challenges. Using the company's broad portfolio of products, which include immersion, spray, vapor and CryoKinetic systems for wafer cleaning, and resist processing systems for wafer coating and developing, customers are able to efficiently achieve their goals. FSI's customers include microelectronics manufacturers located throughout North America, Europe, Japan and the Asia-Pacific region.
FSI maintains a Web site at fsi-intl.com.
"Safe Harbor" Statement Under the Private Securities Litigation
Reform Act of 1995
This press release contains certain "forward-looking" statements (a), including, but not limited to, the size of the wafer cleaning market, the rate of IC makers investment in 300-mm equipment and FSI's ability to gain wafer cleaning marketshare through the successful commercial introduction of the MAGELLAN System. Except for the historical information contained herein, the matters discussed in this news release are forward-looking statements involving risks and uncertainties, both known and unknown, that could cause actual results to differ materially from those in such forward-looking statements. Such risks and uncertainties include, but are not limited to, the length and extent of the current industry downturn; additional order delays or cancellations; savings from our cost-cutting measures may be less than anticipated; we may incur unexpected additional costs as part of our cost cutting measures; general economic conditions; changes in customer capacity requirements and demand for microelectronics; the extent of demand for our products and our ability to meet demand; global trade policies; worldwide economic and political stability; the Company's successful execution of internal performance plans; the cyclical nature of the Company's business; volatility of the market for certain products; performance issues with key suppliers and subcontractors; the transition to 300mm products; the level of new orders; the timing and success of current and future product and process development programs; the success of the Company's affiliated distributors; and litigation and legal proceedings; as well as other factors listed from time to time in the Company's SEC reports including, but not limited to, the Company's Annual Report on Form 10-K for the 2001 fiscal year and the most recent 10-Q. The Company assumes no duty to update the information in this press release.
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Contact:
FSI International, Inc., Minneapolis
Trade Media:
Laurie Walker, 952/448-8066
or
Financial Media and Investors:
Benno Sand, 952/448-8936 |
