We've seen some news, recently, that Intel is prototyping hybrid flash/SRAM chips.
I wonder how well AMD's hybrid solutions are doing:
Multi-Chip Package (MCP) Flash and SRAM Solutions
AMD, the technology leader in Flash memory, announces worldwide availability of its industry-leading family of multi-chip package (MCP) Flash and SRAM memory solutions.
Utilizing a single, convenient package including high-performance AMD Flash and the highest quality SRAM, MCP solutions offer customers the ability to design feature-rich applications while optimizing board space in today’s cutting-edge systems. Over twenty million MCP devices have been flawlessly manufactured and shipped to date – the high-performance, ultra-low power consumption, and unmatched reliability of AMD’s proven MCP devices makes a perfect solution now offered to designers and manufacturers everywhere.
Key features of currently available MCP solutions include the following:
1.8 V
32 or 64 Mb 1.8 V Flash Memory packaged with a 4, 8, or 16 Mb SRAM in a single, consistent Fine-pitch Ball Grid Array (FBGA) package
Award-winning Simultaneous Read/Write (SRW) Flash capability between any two banks for Am41PDS3224D and Am41PDS3228D; between any four banks for Am42BDS6408G and Am42BDS640AG
Page Mode Flash Memory available in the Am41PDS3224D and Am41PDS3228D; 4 word page allows fast asynchronous reads
Burst Mode Flash Memory available in the Am42BDS6408G and Am42BDS640AG; 2 modes of Burst read operation
ZeroPower(TM) Flash when inactive; ultra-low power consumption during standby mode (0.2uA)
SecSi (Secured Silicon) Sector security available for Am41PDS3224D and Am41PDS3228D
3.0 V
16, 32, 64 or 128 Mb 3.0 V Flash Memory packaged with a 2, 4, 8,16 or 32 Mb SRAM in a single, consistent Fine-pitch Ball Grid Array (FBGA) package
Award-winning Simultaneous Read/Write (SRW) Flash capability between any two banks
ZeroPower™ Flash when inactive; ultra-low power consumption during standby mode (0.2 uA)
SecSi (Secured Silicon) Sector security
Upcoming device families Am45, Am49, and Am50 will include Flash Memory combined with Pseudo SRAM. Pseudo SRAM uses a DRAM core with an SRAM interface, allowing for cost reduced SRAM solutions. This makes Flash and PSRAM MCP devices a perfect solution for high density RAM applications. In addition, due to the long term supply of PSRAM as compared to DRAM, it is an ideal replacement for DRAM in-system.
Future MCP devices will feature alternative Flash devices, higher densities, additional packaging options, and new MCP combinations (e.g. Flash + ASIC, Flash + ASIC + SRAM, Flash + Flash, etc.) to meet any design specification.
Small Footprint, Consistent Packaging
Cellular handset designers and other leading manufacturers face the many challenges to eke out the latest features into smaller footprints. MCP devices meet these challenges by offering a single, space-saving package with the industry-leading performance and quality that customers have come to expect from AMD.
Because AMD’s various MCP solutions are stacked in a consistent footprint and pinout, customers can easily design a single-board while differentiating their products. In addition, AMD’s advanced stacking technology can readily be applied to new Flash, SRAM, or other devices as they are introduced. Consequently, AMD will continue to offer customers the most value-added and cost-effective MCP solutions as innovations enter the marketplace.
Streamline Your Supply-Chain, Focus On Your Designs
AMD’s strong partnerships with leading manufacturers not only results in a reliable supply of SRAM for MCP devices, but also ensures that customers can benefit from any cost-reductions or advances in SRAM technology. Additionally, AMD manages the complex logistics, quality, and inventory management issues in procuring the best SRAM available, thereby enabling customers to streamline their supply-chain and focus on creating great products. Finally, AMD’s award-winning customer service and demonstrated commitment to customer success make MCP solutions an ideal choice for most portable applications.
Applications
AMD’s MCP solutions are ideal for a variety of applications requiring high-performance, low power-consumption, and a small footprint:
Wireless Modems
Cellular Handsets
Two-way Pagers
Personal Information Devices
Handheld PCs
GPS Receivers
Wearable Computers
Ordering Information Product Flash Density SRAM Density
(Data Width) (Data Width) Speed Ratings (ns) Package Options
Am41DL16x4DT/B 16 Mb (x8/x16) 4 Mb (x8/x16) 70, 85 69-ball FBGA
Am41DL3208G 32 Mb (x8/x16) 8 Mb (x8/x16) 70, 85 73-ball FBGA
Am41DL32x4GT/B 32 Mb (x8/x16) 4 Mb (x8/x16) 70, 85 73-ball FBGA
Am41DL32x8GT/B 32 Mb (x8/x16) 8 Mb (x8/x16) 70, 85 73-ball FBGA
Am41DL6408G 64 Mb (x8/x16) 8 Mb (x8/x16) 70, 85 73-ball FBGA
Am41PDS3224D 32 Mb (x16) 4 Mb (x8/x16)100,110 Flash;70 SRAM 73-ball FBGA
Am41PDS3228D 32 Mb (x16) 8 Mb (x8/x16)100,110 Flash;70 SRAM 73-ball FBGA
Am42DL16x2DT/B 16 Mb (x8/x16) 2 Mb (x16) 70, 85 69-ball FBGA
Am42DL16X4D 16 Mb (x8/x16) 4 Mb (x16) 70, 85 69-ball FBGA
Am42DL6404G 64 Mb (x8/x16) 4 Mb (x16) 70, 85 73-ball FBGA
Am42DL640AG 64 Mb (x8/x16) 16 Mb (x16) 70, 85 73-ball FBGA
Am42BDS6408G 64 Mb (x16) 8Mb (x16) 70, 85 93-ball FBGA
Am42BDS640AG 64 Mb (x16) 16Mb (x16) 70, 85 93-ball FBGA
Am45DL6408G 64 Mb (x8/x16) 8 Mb (x8/x16) PSRAM 70, 85 73-ball FBGA
Am49DL640BG 64 Mb (x8/x16) 32 Mb (x8/x16) PSRAM 70, 85 73-ball FBGA
Am50DL128BG
Two stacked 64 Mb (x8/x16) 32 Mb (x16/x16) PSRAM 70, 85 73-ball FBGA
*Available in Top (T) or Bottom (B) Boot sector configurations |
