Semitool Receives Multiple 300mm Systems Order
Semitool's Electroplating and Wafer Surface Preparation Equipment Adopted for Wafer Level Packaging
KALISPELL, Mont.--(BUSINESS WIRE)--July 17, 2002-- Semitool, Inc. (Nasdaq:SMTL - News), today announced it has received a multi-million dollar order from Texas Instruments Incorporated for multiple 300mm systems for wafer level packaging. The systems include Semitool's leading-edge 300mm Paragon for electroplating and the Spectrum 300 high productivity, multi-wafer batch processing system, which will be used in multiple chemical etching and stripping processes.
"We are excited about this further opportunity for a close working relationship with Texas Instruments and the opportunity to play an increasing role in supporting their wafer level packaging program. Incorporating critical packaging processes closer to the front end processing fab is a developing industry trend," explained Paul Siblerud, general manager for Semitool's packaging division. He added, "Our established leadership in both electroplating and wafer surface preparation, coupled with our early entry into the wafer level packaging market, has put us in an outstanding position for capturing share in this emerging market."
Bob Kunesh, fab manager of Texas Instruments' DBUMP facility said, "Our successful experience with Semitool equipment in our 200mm packaging line gave us the confidence to adopt Semitool technology for our 300mm facility."
Semitool's 300mm Paragon is a fully automated electroplating tool, incorporating advanced technology for depositing copper and other metals for fab front end and packaging processes. The Paragon features the company's innovative CFD (computational fluid dynamics) electroplating reactor and Capsule cleaning chamber. The state of the art tool is packaged within the industry's smallest footprint for efficient fab floor utilization, and the system is capable of electroplating multiple metals and alloys used in the solder attach process during flip chip assembly, in addition to plating copper for interconnect applications. Together, these innovations provide industry-leading productivity, uniformity and composition control."
The Spectrum 300 incorporates the latest in spray and immersion cleaning technology, including a surface tension-gradient-dry capability in a compact footprint. High throughput and chemical usage substantially lower than competing wet cleaning tools results in a significantly lower cost of ownership. The system performs resist template and under bump metalization removal processes in wafer level packaging applications. The Spectrum can also be configured for polymer removal, metal etch, photoresist removal and other critical cleaning processes in the FEOL and the BEOL for semiconductor manufacturing fabs.
Safe Harbor Statement
Except for historical information, the matters discussed in this news release include forward-looking statements, within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. These include, statements relating to (i) continuation of an industry trend toward incorporating critical packaging processes closer to the front-end processing fab, and (ii) the ability of the company to maintain a leadership position in electroplating and wafer surface preparation and to capture market share in the emerging wafer level packaging market. Semitool's business in general is subject to certain risks and uncertainties that could cause actual results to materially differ from those projected in such forward-looking statements, including, but not limited to, the cyclicality in the semiconductor industry, fluctuations in Semitool's operating results, rapid technological change, the introduction of competing products and technologies and market non-acceptance of Semitool's new products and new applications for existing products, as well as, other risk factors related to our business contained in the company's Annual Report on Form 10-K for the fiscal year ended September 30, 2001 and other filings with the Securities and Exchange Commission. The company assumes no obligation to update or supplement forward-looking statements that become untrue because of subsequent events.
About Semitool, Inc.
Semitool is a worldwide leader in the design, development, manufacture, and support of high performance, single-wafer and multi-wafer batch wet chemical processing systems for use in the fabrication of semiconductor devices. The company's primary suites of equipment include electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems. The company's equipment is used in semiconductor fabrication front-end and back-end processes, including wafer level packaging.
Headquartered in Kalispell, Montana, Semitool maintains sales and support centers in the United States, Europe and Asia. The company's stock trades on the Nasdaq National Market under the symbol SMTL. For more information, please visit the company's website at www.semitool.com.
Semitool is a registered trademark of Semitool, Inc.
--------------------------------------------------------------------------------
Contact:
Semitool, Inc.
Paul Siblerud or Bill Freeman, 406/752-2107
or
Investor Relations Partners, Inc.
Darlene Hershey, 973/535-8389
hershey@irpartners.com |
