SpeedFam-IPEC Ships 300th Orbital CMP Tool
Global Installed Base of Momentum Systems Continues to Expand for Advanced Chip Manufacturing on All Process Applications
CHANDLER, Ariz.--(BUSINESS WIRE)--July 22, 2002--SpeedFam-IPEC, Inc. (Nasdaq:SFAM - News), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, today announced that the total number of its orbital CMP tools installed around the world has reached 300. The tool placement milestone was achieved recently with the shipment of a Momentum(TM) orbital, hard-platen CMP system to a leading device manufacturer in Asia. Momentum will be used for production and development at and below 130 nanometers.
"SpeedFam-IPEC developed the revolutionary orbital platform in 1995 as a method by which to improve wafer polishing uniformity," said company President and CEO Richard J. Faubert. "A dry-in/dry-out orbital CMP system was introduced in 1997--and cost-of-ownership benefits and technology enhancements have been ongoing ever since. In 2000, we launched orbital, hard-platen Momentum, a high-throughput, dry-in/dry-out universal system, which offers best-of-breed planarization for all 130-nm-and-below process applications, and which dramatically reduces consumables usage."
With a growing base of production-proven Momentum tools throughout the United States, Europe and Asia, the 300th orbital tool placement further illustrates SpeedFam-IPEC's successful global account penetration among leading integrated circuit manufacturers.
Faubert said, "We surpassed our original commitment to secure evaluations at top-ranking device manufacturers' sites during the recent industry downturn. With the successful placement of numerous Momentum 200-mm and 300-mm systems, we are now turning our focus to securing multiple tool-of-record decisions that will position us for success at the next upturn. Our customers' growing confidence in Momentum is based on the orbital, hard-platen platform's competitive edge when it comes to process flexibility, cost of ownership and yield. Chipmakers are finding that Momentum's wide, robust process window enables advanced integration schemes previously not possible."
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With more than 1,300 CMP systems installed worldwide, the company enables the development of next-generation integrated circuit technology through its leading-edge polishing systems. SpeedFam-IPEC also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on Nasdaq under the symbol SFAM. The company's web site URL is www.sfamipec.com.
This press release includes statements that constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Reform Act"), and SpeedFam-IPEC claims the protection of the safe harbor for forward-looking statements contained in the Reform Act. These forward-looking statements are often characterized by the terms "may," "believes," "projects," "expects," or "anticipates," and do not reflect historical facts. Specific forward-looking statements contained in this press release include, but are not limited to: (i) SpeedFam-IPEC's assertion that there will continue to be further successful global account penetration; and (ii) SpeedFam-IPEC's assertion that its customers' confidence in Momentum is growing.
Forward-looking statements involve risks, uncertainties and other factors that may cause actual results, performance or achievements of SpeedFam-IPEC to be materially different from those expressed or implied by such forward-looking statements. Factors that could affect SpeedFam-IPEC's results and cause them to materially differ from those contained in the forward-looking statements include risks set forth in SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001 and the Quarterly Report on Form 10-Q filed on April 10, 2002, and include: (i) current depressed market conditions in the semiconductor industry; (ii) SpeedFam-IPEC's ability to preserve its capital reserves and raise or generate sufficient capital to fund operations; (iii) the possible significant dilution of the company's outstanding common stock in connection with any new financing or refinancing; (iv) the ultimate success of SpeedFam-IPEC's business model, which is highly predicated on the successful market acceptance of its Momentum and Momentum300 products, and on sales of Momentum, which may not occur on the scale or in the timeframe anticipated; (v) possible constraints on the roll-out of Momentum tools due to manufacturing problems, unforeseen technical problems or changes in the CMP marketplace that differ from the company's expectations; (vi) SpeedFam-IPEC's dependence on selling a small number of high-priced machines to a small number of major customers; (vii) intense competition from companies with greater resources; (viii) prospects of, and risks related to, international markets and the global economy, given that SpeedFam-IPEC depends heavily on international sales; and (ix) other factors that SpeedFam-IPEC is currently unable to identify or quantify, but which may exist in the future.
Forward-looking statements speak only as of the date the statement was made. SpeedFam-IPEC does not undertake and specifically declines any obligation to update any forward-looking statements.
--------------------------------------------------------------------------------
Contact:
SpeedFam-IPEC
Tamara M. Berry, 480/705-2473 (Marketing Communication)
tberry@sfamipec.com
Lisa Lyscio, 480/705-2119 (Investor Relations)
llyscio@sfamipec.com |
