SFAM multiple tool order:
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Tuesday July 23, 7:46 am Eastern Time
Press Release
SOURCE: SpeedFam-IPEC, Inc.
Top-10 Global Semiconductor Manufacturer Places Multi-Tool CMP Order With SpeedFam-IPEC
Momentum 200-mm and 300-mm Planarization Systems Selected for Tungsten, Oxide Production and Development At and Below 130 nm
CHANDLER, Ariz.--(BUSINESS WIRE)--July 23, 2002-- SpeedFam-IPEC, Inc. (Nasdaq: SFAM - News), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, has announced that a top-10 chipmaker has placed orders for both 200-mm and 300-mm Momentum(TM) CMP systems. The multinational chipmaker with headquarters in Europe selected Momentum for tungsten and oxide production and process development at the 130- and 100-nanometer nodes. The orbital, hard-platen polishing tools were selected based on Momentum's unique cost-of-ownership and productivity advantages at and below 130 nm.
With a growing installed base of Momentum tools throughout the United States, Europe and Asia, these most recent orders further demonstrate SpeedFam-IPEC's successful global account penetration among leading device manufacturers. The systems are scheduled for shipment over the next six months.
SpeedFam-IPEC President and CEO Richard Faubert said, "We surpassed our original commitment to secure evaluations at top-ranking device manufacturers' sites during the recent industry downturn. With the successful placement of numerous Momentum 200-mm and 300-mm evaluations, we are now turning our focus to securing multiple tool-of-record decisions that will position us for success at the next upturn."
He added, "Our customer is a world leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. They made a commitment to Momentum technology for tungsten and oxide applications after reviewing results gathered during rigorous process development runs in their fabrication facilities. And, once again, Momentum has demonstrated superior process capability, has proven its flexible and wide process window and has delivered attractive cost-of-ownership benefits -- particularly when it comes to throughput and consumables use."
Faubert concluded, "Our customer's order for multiple Momentum systems offers yet additional testimony to the advantages of the platform's unique total wafer metrics control capabilities. Momentum consistently delivers a competitive edge when it comes to repeatability, technological extendibility, process flexibility and wafer profile tuneability." |
