Bit o'News: more orders. Stock is still near lows.
<quoted under fair use from news release>
Veeco Surface Metrology Receives $3 Million
Order from Siemens; Siemens Buys Multiple
Surface Profilers and Atomic Force Microscopes
Business Editors
SANTA BARBARA, Calif.--(BUSINESS WIRE)--July
16, 1996--Veeco Surface Metrology has received
an order in excess of $3 million from Siemens
Microelectronics Center GmbH & Co. OHG in
Dresden, Germany. The order, which includes four
Dektak SXM atomic force microscopes and three
Dektak 8200 automated surface profilers, will be
used for DRAM manufacturing at Siemens'
semiconductor fabs in Germany, France and
England.
"We are pleased to have been chosen as a
full-service provider of surface metrology
equipment by Siemens," said Dr. Timothy Stultz,
vice president and general manager of Veeco
Surface Metrology. "This multi-fab order
reflects confidence in our global service and
support, and the synergy between our automated
surface profilers and atomic force microscopes."
The Dektak SXM atomic force microscope (AFM) is
used to monitor semiconductor manufacturing
processes by providing critical dimension (CD)
measurements of lines and spaces as small as
0.25 micron. It gives repeatable measurements in
three dimensions with an accuracy comparable to
transmission electron microscopy (TEM). This
reduces the need for time-consuming and costly
wafer cross-sectional inspection, which is often
used to measure depth and sidewall angles of
submicron features. The Dektak SXM is an
automated, in-line production metrology tool
that provides non-contact, nondestructive
nanometer scale measurements. Exclusive scanning
and probe tip technologies enable the system to
profile vertical sidewalls and even re-entrant
sidewalls.
The Dektak 8200 automated surface profiler
enables semiconductor manufacturers to
continually monitor and perfect key aspects of
process performance including deposition
uniformity, etch rate and chemical mechanical
polishing (CMP) planarity. This automated
surface profiler is capable of repeatably
measuring wafer topography and the vertical
heights of semiconductor thin films to within 10
angstroms. At its heart is Veeco's new SoftScan
II low-inertia sensor, which enables
nondestructive measurements on product wafers,
even on very soft films such as photoresist.
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