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Technology Stocks : Intel Corporation (INTC)
INTC 36.82+1.5%Dec 19 9:30 AM EST

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To: Dan3 who wrote (168850)7/31/2002 1:57:12 AM
From: ted burton  Read Replies (3) of 186894
 
Re:Intel used to give junction temps, which couldn't be compared to AMD's die temps (or measured outside of a laboratory, for that matter), but the metal case wrapped tightly around the P4 die will be very close to the temperature of the die. Especially when you consider that measurements of AMD's die temp (look at the thermal guidelines docs on their web site) and Intel's case temp are actually made at the interface between the heat sink and the case/die - which acts as a case on top of the Athlon - the numbers are effectively identical.

Dan - I really like the confident tone you use when spewing this garbage. I've simulated this, and I've measured this. The case and die temps are definately not the same. By the way, it's not the Athlon that has the case.

All you have is a disjointed pairing of temperatures from two different spots in competing thermal systems. You have no factual basis to judge which thermal system is better. Since your intuition on thermal matters is about as bad as it can get, you're input on this subject is anything BUT enlightening.

Furthermore, your statement that one part is frail because YOU think it's cheating by using a better thermal solution is a fairly transparent case of sour grapes, & one which I'm really regretting getting involved in.

-Ted
P.S. Although I am an Intel employee, I don't speak for my employer.
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