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Technology Stocks : Intel Corporation (INTC)
INTC 36.82+1.5%Dec 19 9:30 AM EST
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To: ted burton who wrote (168878)7/31/2002 8:55:06 AM
From: Dan3  Read Replies (5) of 186894
 
Re: one part is frail because YOU think it's cheating by using a better thermal solution

You've got it backwards. AMD's uncased die is more easily damaged than Intel's cased die, but it also provides a better heat transfer interface. Intel's case protects the die from some installation screw-ups, but can cook the chip during use.

If anyone has a better thermal solution, it's AMD, but the trade-off is that an inexperienced installer is a little more likely to damage the chip. Note that AMD used a case on the old K6-2, but elected to go with a bare die for Athlon to improve thermal conduction. Also note that the surface of a sealed box will be at the same temperature as its contents, e.g. the temperature of a die, and the wrapping of a tightly wrapped die, will be the same. It's called the law of conservation of energy....
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