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Technology Stocks : Intel Corporation (INTC)
INTC 37.81-4.3%Dec 12 9:30 AM EST
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To: Yousef who wrote (169351)8/13/2002 1:01:30 PM
From: Elmer  Read Replies (1) of 186894
 
Copper interconnects with new Low-k dielectric: The process also integrates a new carbon-doped oxide (CDO) dielectric material that increases signal speed inside the chip and reduces chip power consumption. This dielectric is implemented in a simple, two-layer stack design, which is easy to manufacture.

Yousef, can you comment on this dielectric?
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