KLA-Tencor's New Defect Monitoring Solution Speeds Ramp of Advanced Lithography Processes Into Volume Production
Monday September 16, 7:19 pm ET
SAN JOSE, Calif., Sept. 16 /PRNewswire-FirstCall/ -- KLA-Tencor (Nasdaq: KLAC - News) today introduced MicroPCM(TM) ("Micro Photo Cell Monitor"), its latest defect management solution designed to help chip manufacturers overcome challenges associated with ramping their advanced lithography processes into production. Combining KLA-Tencor's most advanced defect management hardware and software tools, a new proprietary reticle design, optimized test wafers, and industry-leading expertise, MicroPCM provides fabs with an efficient and cost-effective methodology that enables them to identify and eliminate lithography-related micro defects before product lots are placed at risk. As a result, customers using MicroPCM can accelerate the development of their most advanced lithography processes, as well as increase their baseline yields during volume production. MicroPCM is already in use at four 300-mm fabs for developing and monitoring 130-nm and smaller design rule processes.
"With the production success of each new device generation dependent upon the lithography process, it is essential for fabs to have a comprehensive methodology in place to monitor micro-defect density in the lithography cell," said Walter Walbrick, photo process section manager at Texas Instruments' DMOS6 fab. "MicroPCM is an effective way to identify and quickly resolve defect issues related to the lithography process. The cost of missing these lithography related micro-defects can be enormous as there can be a significant impact on yield. By implementing a MicroPCM solution, we were able to establish an optimal lithography cell monitoring strategy that reduced our defect density by as much as 90 percent in two-and-a-half months, which increased overall baseline yields."
The introduction of thinner photoresists, new resist chemistries, tighter process windows and smaller design rules have all given rise to new and smaller defect types within the lithography cell -- the largest area of investment within the fab. Defect management in the lithography cell is a critical requirement for qualifying new lithography processes, and establishing a benchmark for controlling defects and minimizing yield losses during production. The move to 300-mm wafer processing has intensified the need for fast and accurate defect monitoring in the lithography cell during production, since more than twice as much product is potentially at risk on 300-mm wafers as compared to 200-mm wafers. MicroPCM monitors the health of the entire lithography cell by enabling chipmakers to make rapid and accurate "go/no-go" decisions about their product reticles, track systems and exposure tools.
Ingredients for Advanced Lithography Production Success
MicroPCM combines the latest advances in KLA-Tencor's portfolio of defect management hardware and software tools, intellectual property and industry- leading expertise. Elements include:
-- KLA-Tencor's 23xx series high-resolution imaging inspection system,
which provides the highest sensitivity to critical photo defects, such
as affected pattern, residual photoresist, bubbles and embedded
particles
-- in-line automatic defect classification (iADC) software, which
expedites root-cause defect analysis
-- MicroPCM Reticle(TM), a standard reticle design that provides
benchmarking of lithography processes and defect control methodologies,
and facilitates their transfer from development to production, as well
as between fabs
-- fully-patterned test wafers, which are designed to minimize process-
induced noise and are optimized for use on the 23xx inspection system
-- expert resources to help chipmakers develop customized and optimal
statistical process control (SPC) and inspection sampling strategies
"Today, a significant portion of the total number of defects in a fab originates within the lithography cell. Reducing these defects is a vital step in any lithography process development and implementation effort," stated Rick Wallace, executive vice president of KLA-Tencor's Wafer Inspection Group. "It's not simply a matter of having the most advanced wafer inspection systems. What's needed is a comprehensive defect reduction strategy in the lithography cell that balances value and risk-enabling chipmakers to maximize their return on investment, while minimizing their inspection costs. MicroPCM provides our customers with a unique cost-effective approach that enables them to better control defectivity in their lithography cells and meet their aggressive process ramp schedules."
KLA-Tencor will showcase MicroPCM at the SEMICON Taiwan 2002 exhibition, September 16-18, at booth #2312 at the Taipei World Trade Center.
About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., with operations around the world, KLA-Tencor ranked #6 on S&P's 2002 index of the top 500 companies in the U.S. KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC. Additional information about the company is available on the Internet at kla-tencor.com .
NOTE: MicroPCM and MicroPCM Reticle are trademarks of KLA-Tencor.
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Source: KLA-Tencor |
