Copper fab tools to grow 27% in '02 and 84% in '03
By Semiconductor Business News
Sep 23, 2002 (12:36 PM)
URL: siliconstrategies.com
NEW TRIPOLI, Penn. -- The market for front-end fab gear for copper processing of IC interconnects will grow slightly more than 27% in 2002 and 84% in 2003, according to a report from The Information Network here today.
Copper tools represented 10% of the total front-end equipment revenues in 2001, and will grow to 14% in 2002, according to the New Tripoli-based market research firm. The largest growth in 2002 will be in the etch sectors, followed by the barrier/seed deposition markets, the company said.
Copper-based front-end tools include electroplating, barrier/seed, dielectric etch, CMP, dielectric deposition, metrology, RTP, and metal etch.
"While falling consumer confidence and rising job cuts pose threats to the U.S. economys recovery and hence the semiconductor industry, the market for copper processing tools for IC production will grow more than 27% in 2002 and a further 84% in 2003 as the industry recovers from two down years,” said Robert Castellano, president of The Information Network.
“The copper processing equipment market grew 117% in 2001 at a time when the overall equipment market dropped 40%, according to our study,” he added. |
