ESI Introduces Model 5430 UV Laser Microvia Drilling System
Businesswire, Monday, October 28, 2002 at 12:44
TAIPEI, Taiwan, Oct 28, 2002 (BUSINESS WIRE) -- Electro Scientific Industries, Inc. (Nasdaq:ESIO) introduces the Model 5430 Ultra Violet (UV) Laser Microvia Drill to serve the emerging market for high volume manufacturing of advanced integrated circuit package designs.
ESI will be showcasing the 5430 technology at TPCA from October 30 through November 2, 2002 at the Taipei World Trade Center in Taiwan."The model 5430 has received strong customer approval for high volume integrated circuit packaging,"said Steve Vickers, Director of ESI's Advanced Packaging Products."A major Asian package producer has begun placing these systems into production for the latest microprocessor designs."RETURN RETURN"Via diameters for the latest microprocessors are in the sweet spot of our UV technology roadmap,"continued Vickers."Today's high-end integrated circuit packages are routinely drilled at sub-70 micron diameter and have greater than 1,000 I/Os. ESI's UV technology offers customers a clear advantage to produce even smaller via diameters for more complex integrated circuit designs in the future."Manufacturers of electronic packages continue to look for ways to increase productivity. The Model 5430 incorporates high power diode-pumped lasers with high repetition rates of up to 70 kHz resulting in a throughput advantage of 80% over conventional single head UV drilling systems. The UV lasers' short pulse width delivers excellent via quality and is capable of generating via diameters as small as 25 microns -- smaller than the size of a human hair.
The Model 5430 is an extension of the 5400 family, which was designed to protect the manufacturers' capital investment. ESI will continue to pioneer technology for IC packaging and this capital protection plan allows customers to affordably upgrade as new technology is introduced. For example, the system architecture allows for the latest model laser, optical components or galvanometer to be replaced at the customer site.
The system also features ESI's optional shaped beam technology. The shaped beam guarantees excellent quality and high throughput to improve registration and perform ablation of non-reinforced dielectric and soldermask material. A highly circular beam of uniform intensity produces very circular vias, high throughput and excellent bottom copper quality with no resin residue.
The 5400 series drills are the first laser systems in the world with programmable dual head spacing ensuring maximum throughput with any given application. The patented Compound Beam Positioner incorporates seven axes of coordinated motion control, eliminating stepping time and abutment errors. No external water or gas is needed allowing for easy installation and low operating costs.
About ESI's Advanced Packaging Products
ESI's Advanced Packaging Group (APG) product line provides innovative, cost effective via solutions to the high density interconnect (HDI) and advanced packaging markets. Anticipating design and production needs, APG continuously targets improved accuracy and production rates, while simultaneously providing solutions that enable customers to shrink pad design for increased density of the circuit board or electronic package. By offering complete via technology, regardless of drilling method deployed, ESI is committed to meeting the challenges of existing and emerging applications in integrated circuit (IC) packages, multi-chip modules and high density printed wiring boards.
About ESI
ESI, headquartered in Portland, Oregon, supplies high-value, high-technology manufacturing equipment to the global electronics market. Using its expertise in laser/material interaction, small parts handling, machine vision and real-time control systems, the company enables the production of leading-edge products for customers in the semiconductor, passive component and electronic interconnect markets. ESI's web site is esi.com. |
