Asyst Expands Capabilities of Leading Connectivity Software to Meet Industry's Most Advanced 300mm Manufacturing Requirements
Thursday November 14, 6:02 am ET
Newest Version of GWconX300(TM) Software Addresses Communications Needs of 300mm Equipment with Complex Internal FOUP Buffers
FREMONT, Calif.--(BUSINESS WIRE)--Nov. 14, 2002-- Asyst Technologies, Inc. (Nasdaq:ASYT - News) today introduced enhancements that enable its GW Associates GWconX300(TM) software to solve communications challenges associated with wafer fabrication equipment that uses an internal buffer or mini-stocker, instead of an external load port, to process front-opening unified pods (FOUPs) full of 300mm wafers. This represents a new market opportunity for Asyst, enabling the company to extend its market-leading position in OEM tool connectivity software.
GWconX300 was originally designed to handle the manufacturing-communications requirements of fixed-buffer equipment, in which a load port bolted onto the outside of the tool interfaces with an automated material-handling system (AMHS) to load FOUPs back and forth for processing. While about 90 percent of semiconductor-manufacturing tools utilize this kind of structure, a small but critical percentage of equipment, including such tools as diffusion furnaces and wet benches, contains internal buffers. These systems, which intake, process and store FOUPs via a FOUP buffer or mini-stocker, essentially include part of the AMHS within the equipment and, therefore, require much more complicated software to address internal connectivity challenges.
"Our goal in adding these enhancements to GWconX300 was twofold," said Paula LuPriore, vice president/general manager, Connectivity Solutions at Asyst Technologies. "First, it is our goal to make GWconX300 the de facto industry standard for advanced 300mm tool connectivity, and it is therefore important that the product be capable of running on all tools in a fab. Second, since internal-buffer-based systems do not use our load ports, this new capability provides an entree into these markets and an opportunity to expand our 300mm technology reach."
GWconX300 is software for implementing communications links on semiconductor wafer fabrication equipment, using the new Semiconductor Equipment and Materials International (SEMI) standard protocols required for all 300mm and advanced 200mm factory-automation systems. It provides run-time software libraries designed for incorporation with the embedded control software of any type of 300mm equipment. GWconX300 also provides tools for rapid development and integration of connectivity software. Key features include automated handling of intercompatibility between new SEMI standards; field-configurable adjustments that ensure compatibility of equipment with older legacy host computers; automatic process, syntax checks and replies to all messages mandated by the specified SEMI standard; and hooks for synchronization with the SEMI E84 standard, which ensures a smooth handshake between production equipment and the AMHS.
Currently in beta testing, the enhanced version of GWconX300 will be in production volume by the first quarter of next year. More information about Asyst's 300mm connectivity solutions will be presented at a workshop on December 5, at the Makuhari Prince Hotel, from 1:00-6:00 p.m. to coincide with SEMICON Japan 2002. Asyst also will be demonstrating its 300mm hardware and software solutions in its booth #7-B301 at SEMICON Japan, December 4-6, at the Makuhari Messe Exhibition Center, Chiba, Japan.
Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to, general economic conditions, semiconductor industry cycles, risks associated with the acceptance of new products and product capabilities and other factors more fully detailed in the Company's recent 10Q quarterly report on file with the Securities and Exchange Commission.
About Asyst: Asyst Technologies, Inc. is a leading provider of integrated automation solutions that enable semiconductor manufacturers to increase manufacturing productivity and protect investments in silicon wafers during the manufacture of integrated circuits, or ICs. The company offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between process equipment and the fab line throughout the IC fabrication process, while reducing IC damage caused by human, environmental, mechanical and chemical factors. Encompassing isolation systems, work-in-process materials management, substrate-handling robotics, automated transport and loading systems, and connectivity automation software, Asyst's modular, interoperable solutions allow chipmakers and original equipment manufacturers, or OEMs, to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs. Asyst's homepage is asyst.com.
GWconX300 is a trademark of Asyst Technologies, Inc.
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Contact:
Asyst Technologies, Inc.
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pmah@asyst.com
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or
MCA
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djones@mcapr.com
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Source: Asyst Technologies |
