Fab-tool book-to-bill reaches parity
Semiconductor Business News
(01/16/03 03:44 p.m. EST)
SAN JOSE--In an indicator that business is improving, the worldwide chip-equipment book-to-bill ratio reached 1.00 in December of 2002, up from 0.97 in November of last year, according to new figures from VLSI Research Inc. here today.
The worldwide fab-tool book-to-bill is expected to reach 1.09 in January, according to the San Jose-based market research firm. The book-to bill ratio has been steadily climbing since September 2002, but remains below the peak of 1.31 in April.
Worldwide bookings amounted to $2.503 billion in December, while billings were at $2.496 billion last month, according to VLSI Research. In comparison, worldwide bookings were $2.978 billion, while billings were $3.059 billion in November of 2002, according to VLSI Research.
Of the total billings in December, $1.428 billion were for wafer processing equipment, $566 million for test and related equipment, $137 million for assembly, and $365 million for service and spares. |
