China's Shanghai Hua Hong to boost CapEx
Semiconductor Business News
(01/20/03 12:57 p.m. EST)
SHANGHAI--Responding to improved IC demand, silicon foundry provider Shanghai Hua Hong NEC Electronics Co. of China here has set plans to boost its capital spending and wafer output for 2003, according to a report from Dow Jones.
The joint foundry venture between Japan's NEC Corp. and the China government will spend about 10 billion yen ($85 million) to raise its capacity, the report said. The Shanghai-based venture will also boost its monthly capacity to 32,000 units of 200-mm silicon wafers, from 20,000 units, it added.
This represents the first time the company has increased its capital spending since 2001. Formed in 1997, Shanghai Hua Hong built its first fab in 1999. The $1.2 billion plant is a 0.25-micron facility capable of making 20,000 wafers a month.
The company's first foundry products were DRAMs, but it is also expanding into IC card chips, logic devices, mixed-signal ICs, SRAMs and flash memories. Last year, it claimed to be the first chip maker in China to produce parts at 0.18-micron geometries (see Jan. 7, 2002 story ). |
