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Technology Stocks : Semi Equipment Analysis

SOXX 342.47

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Jan 16 4:00 PM EST

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To: Kirk © who wrote (8171)	1/23/2003 2:40:15 PM
From: Cary Salsberg	Read Replies (1) of 95738

A customer quote from a news release about the sale of Maxxams. ASE Vice President of Operations T.S. Chen commented, "We are pleased with the performance of the Maxum ball bonders for ultra-fine-pitch, high-lead-count semiconductor packages. These bonders will supplement those already in operation and will be used for ball grid array (BGA) packages and other devices requiring leading edge capabilities."

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