FSI Receives Patent for New Immersion Cleaning Method
Thursday January 23, 8:01 am ET
Combination of Wet Etching and Cleaning with Surface Tension Gradient Rinsing and Drying Produces Ultra-Clean Semiconductor Surfaces
MINNEAPOLIS--(BUSINESS WIRE)--Jan. 23, 2003-- FSI International Inc. (Nasdaq:FSII - News) today announced that it has been awarded U.S. Patent No. 6,491,043, which covers a method for wafer cleaning that combines FSI's proprietary Surface Tension Gradient (STG®) rinse/dry technology with a wet etching step. This patent further strengthens FSI's family of 13 patents that claim priority from FSI's original patent application on November 14, 1994. This family of patents covers advanced and unique approaches to immersion cleaning technology, available with the FSI MAGELLAN(TM) 300 STG® Immersion Clean System.
"Our family of patents related to Surface Tension Gradient rinsing and drying covers many aspects of how this technology is used to enhance the performance of immersion cleaning systems," said Jeff Butterbaugh, surface conditioning chief technologist at FSI. "Combining wet etching operations with our superior rinsing and drying technology sets the benchmark for next-generation immersion systems and allows us to offer better process performance, a smaller footprint and a reduction in cycle time."
An application of this technology is made in the FSI MAGELLAN Immersion Clean System where wafers can either be transferred from an etch tank directly to an STG Rinse/Dry tank or where wafers can be etched in the STG Rinse/Dry tank before transitioning to the final rinse/dry. FSI has several additional patents pending for further improvements of this technology.
"We remain committed to our R&D efforts and technological advancements. FSI has been granted 75 U.S. patents in the areas of immersion, spray and gas-phase surface conditioning technology and applications know-how. As a result, the continued strength of our intellectual property contributes to a strong product portfolio and proven customer solutions," said John Ely, president of the Surface Conditioning Division at FSI.
The MAGELLAN(TM) 300 STG® Immersion Clean System is designed to address the challenges of 300-mm manufacturing at 100-nm and below technology nodes. The innovative system offers short cycle time, versatility and high process performance in a footprint up to 40 percent smaller than the competition. Conventional concentrated chemistries, as well as advanced dilute, ozone and gas-to-chemical chemistries, can be used in the system.
FSI International Inc., a global supplier of wafer cleaning and resist processing equipment and technology, delivers economic and technical advantages for current and emerging microelectronics manufacturing challenges. Using the company's broad portfolio of products, which include immersion, spray, vapor and CryoKinetic systems for wafer cleaning, and resist processing systems for wafer coating and developing, customers are able to efficiently achieve their goals. FSI's customers include microelectronics manufacturers located throughout North America, Europe, Japan and the Asia-Pacific region.
FSI is a 2002 recipient of the VLSI Research 10 BEST Award. In seven of the last ten years, FSI has been recognized for its superior customer satisfaction in the category of Small Suppliers of Wafer Processing Equipment.
FSI maintains a Web site at fsi-intl.com.
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Contact:
FSI International Inc., Minneapolis
Trade Media:
Laurie Walker, 952/448-8066
or
Financial Media and Investors:
Benno Sand, 952/448-8936
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Source: FSI International Inc. |
