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Technology Stocks : Semi Equipment Analysis

SOXX 342.47

+1.6%

Jan 16 4:00 PM EST

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To: Kirk © who wrote (8171)	1/28/2003 4:13:45 PM
From: Kirk ©	Read Replies (2) of 95738

I don't think we resolved my question: Were the KLIC higher orders for technology or capacity? I wrote: >>I believe this is a technology issue, not a capacity issue. I think I remember reading that the new Maxxam bonder is needed for more advanced chips. >That would make sense. For a wirebonder, I think the only technology upgrades besides productivity would be finer pitch, higher quality, bigger chips or different metals. Have I missed some? This page kns.com seems to indicate that the old bonder would do 45um bonds but users get higher productivity with the "Maxum IC Ball Bonder". So, that says to me that buyers are adding capacity unless all of a sudden some major users are going to larger chips. Now if I look at Gallery charts of two back end wafer fab companies I track, KLIC and UTEK, then they both seem to be showing some relative strength, UTEK especially: stockcharts.com\|B Didn't TSMC's Morris Chang pretty much say he expected higher shipments soon and his capital equipment budget has a higher upper end than people were predicting just a week ago? Kirk

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