FSI International Receives Follow-On Order from Leading 300-mm Semiconductor Manufacturer
Tuesday March 25, 7:00 am ET
Surface Conditioning Systems will be Installed in European R&D Facility
MINNEAPOLIS--(BUSINESS WIRE)--March 25, 2003--FSI International Inc. (Nasdaq:FSII - News) today announced that it has received follow-on orders for ZETA® 300 Surface Conditioning Systems from a leading global semiconductor manufacturer. The 300-mm tools will be installed at a European R&D facility formed through a multi-company development program, which currently has multiple ZETA 300 Systems installed. The ZETA 300 systems will be used for front-end-of-line (FEOL) and back-end-of-line (BEOL) wafer cleaning processes.
"This request for additional ZETA 300-mm tools reflects the ongoing success that this customer has experienced with its existing FSI systems, as well as the ZETA system's ability to continue delivering value through decreasing technology nodes. As part of the development program, this customer is focused on cultivating and building 90-nm to 32-nm chip technologies over the next five years. By playing a part in these efforts, FSI is demonstrating the robust and flexible nature of our systems and our commitment to the progression of technology," said John Ely, president of FSI's Surface Conditioning Division and corporate vice president. "The work done through this alliance will have a strong impact on both the IC manufacturing industry and the future growth of the member companies."
The ZETA 300-mm Surface Conditioning System is designed for batch spray FEOL and BEOL cleaning processes at technology nodes of 130-nm and below. The system uses centrifugal spray technology; wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged chamber. FSI's versatile chemical delivery technology prepares the chemicals at controlled composition and temperature, and delivers them directly onto the wafers. The ZETA System is proven for a wide range of applications, including FEOL resist strip and post-ash clean, BEOL post-ash clean, salicide strip, C4 clean and wafer reclaim.
FSI International Inc., a global supplier of surface conditioning equipment and technology, delivers economic and technical advantages for current and emerging microelectronics manufacturing challenges. Using the company's broad portfolio of products, which include immersion, spray, vapor and CryoKinetic systems for wafer cleaning, customers are able to efficiently achieve their goals. FSI's customers include microelectronics manufacturers located throughout North America, Europe, Japan and the Asia-Pacific region.
FSI is a 2002 recipient of the VLSI Research 10 BEST Award. In seven of the last ten years, FSI has been recognized for its superior customer satisfaction in the category of Small Suppliers of Wafer Processing Equipment.
FSI maintains a Web site at fsi-intl.com.
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Contact:
FSI International Inc., Minneapolis
Trade Media:
Laurie Walker, 952/448-8066
or
Financial Media and Investors:
Benno Sand, 952/448-8936
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Source: FSI International Inc. |
