KLA-Tencor to debut 90-nm inspection tool
KLA-Tencor Corp. is reportedly preparing to announce a 90-nm version of its reticle inspection system, dubbed TeraStar, according to sources. The new tool is geared to inspect masks at the 90-nm node and below.
However, sources believe that DuPont, IBM, Intel, Micron, and Samsung have already taken delivery on the new TeraStar machine from KLA-Tencor of San Jose, sources said.
Sources believe that KLA-Tencor is also asking for a premium for the 90-nm TeraStar tool, because the unit is so far ahead of the competition. The tool sells for between $10-to-$20 million per unit, according to sources.
Last year, KLA-Tencor rolled out the TeraFlux, a new option for its TeraStar reticle inspection system for 130-nm mask applications. TeraFlux enables the detection of minute, lithographically significant defects on the highly critical contact- and via-layer reticles prior to the first printing at the wafer fab.
The current version uses die-to-die inspection and is optimized for 130-nm production and 100-nm development. KLA-Tencor will unveil a die-to-database version of TeraFlux as a next step on the TeraStar product roadmap.
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