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Technology Stocks : Applied Materials No-Politics Thread (AMAT)
AMAT 230.17-1.4%Nov 7 9:30 AM EST

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To: Gottfried who wrote (6288)6/16/2003 10:09:30 PM
From: Proud_Infidel  Read Replies (1) of 25522
 
Fab-tool book-to-bill remains anemic, says VLSI Research

By Mark LaPedus
Semiconductor Business News
(06/16/03 08:39 p.m. EST)

SAN JOSE, Calif. - The fab-tool business remains anemic, as the worldwide semiconductor equipment book-to-bill ratio was 0.95 in May, down from 0.97 in April, according to new figures from VLSI Research Inc. today (June 16).

This is the fourth month in a row that the ratio was below 1.00 and reflects the dearth of activity in equipment buying, according to the San Jose-based market research firm.

The report follows VLSI Research's move to cut its chip and fab-tool forecasts for 2003. Last month, the firm projected the IC market will grow 9.3 percent to $131.8 billion in 2003 over 2002. The fab-tool market is expected to reach $31.3 billion in 2003, up 5.6 percent from 2002, according to the San Jose-based market research firm (see March 12 story ).

The firm has already lowered its forecasts at least once. Earlier in the year, it predicted the semiconductor and fab-tool industries would grow a modest 11% and 6% in 2003, respectively

The figures differ from other research houses. Except for the lithography sector, the recovery for front-end semiconductor equipment has started after a severe downturn, according to The Information Network. The entire front-end semiconductor equipment market will grow 7.3 percent in 2003, according to the research firm (see June 5 story ).

Meanwhile, in VLSI Research's view of the world, worldwide equipment bookings amounted to $2.354 billion, while billings were at $2.485 billion in May. In comparison, the equipment bookings were $2.422 billion, while billings were $2.506 billion in April.

Of the billings, $1.458 billion were for wafer processing equipment, $553 million for test and related equipment, $139 million for assembly, and $334 million for service and spares.

Of the total billings for April, $1.440 billion were for wafer processing equipment, $539 million for test and related equipment, $191 million for assembly, and $336 million for service and spares.

There may be some light at the end of the tunnel. The fab-tool book-to-bill is expected to improve to 0.97 in June. Billings are expected to hit $2.645 billion in June, while booking are projected to reach $2.562 billion.
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