Applied tips low-k roadmap down to 45-nm
By Mark LaPedus
Semiconductor Business News
(06/27/03 11:14 a.m. EST)
SANTA CLARA, Calif. -- Applied Materials Inc. here disclosed new details about its low-k dielectrics roadmap, showing it plans to extend its “Black Diamond” technology down to the 45-nm node.
At present, Applied is shipping its first-generation, low-k film, which is based on a chemical-vapor deposition (CVD) technology. The company's film, dubbed Black Diamond, has a k value of 3, with a hardness of 2-GPa and modulus of 12-GPa. Overall, the company's film has a k-effective rating of 3.2.
Several chip makers are developing products based on Applied's low-k film, including Advanced Micro Devices, Agere, NEC, Motorola, and Taiwan Semiconductor Manufacturing Co. Ltd.
At 65-nm, Applied is readying what some call Black Diamond II, a next-generation film for complex chips. The next-generation Black Diamond film is expected to have a k value of 2.6 and a k-effective of 2.8, according to the company.
Then, at 45-nm, the company is targeting the film to support k values of 2.4, with a k-effective of 2.6. No details were given for the hardness and modulus for the film at the 65- and 45-nm nodes.
At the 65-nm node and beyond, several low-k providers are looking to push films with k values of far below 2.5. But Applied believes that chip makers will not take such aggressive steps. Instead, IC makers will take incremental steps as a means to lower their risks with the complex technology. “It's going to be more evolutionary than revolutionary,” said Ken MacWilliams, chief technology officer with the Dielectrics Systems Group at Applied. |
