Kulicke & Soffa Announces Order for Maxum Ball Bonders
Wednesday July 16, 2:12 pm ET
WILLOW GROVE, PA--(MARKET WIRE)--Jul 16, 2003 -- Kulicke & Soffa Industries, Inc. (NasdaqNM:KLIC - News) today announced that the company has received an order for 70 Maxum ball bonders from Siliconware Precision Industries Co., Ltd. (NasdaqNM:SPIL - News) of Taichung, Taiwan. SPIL will take delivery of this equipment immediately as a result of their growing demand for production of high end customers' IC packages.
Mr. Patrick Lin, Director of Purchasing of SPIL, stated, "We have a lot of experience with the K&S Maxum ball bonder. We are able to use this machine to produce very high quality devices with the best possible throughput and productivity. Our decision to purchase more of the Maxum bonders is based on the performance record of the Maxum and it's competitors. It is currently our preferred choice for wire bonding equipment."
Christian Rheault, Vice President of K&S Ball Bonder Business Unit, commented on the order from SPIL, "The Maxum ball bonder is clearly ahead of the technology curve for IC assembly. I am especially pleased that SPIL has awarded us with this order because it validates our own beliefs about the leadership position of this machine, with respect to the current packaging roadmap and the competition's machines."
About Kulicke & Soffa
Kulicke & Soffa (NasdaqNM:KLIC - News) is the world's leading supplier of wire bonding equipment in the semiconductor assembly market. K&S is the only equipment supplier that also develops and manufactures the products that touch a semiconductor chip's wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip's package. These products include: test probes; bonding wire; and capillaries, which provide an all-inclusive interconnect process when used with the company's wire bonding equipment. In addition, the company offers wafer dicing equipment and cutting blade solutions as well as Flip Chip wafer bumping services and technology. Chip scale and wafer level packaging solutions include Ultra CSP® technology. Test interconnect products include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, as well as test sockets and contactors for all types of packages. Kulicke & Soffa's web site address is www.kns.com.
Caution Concerning Forward Looking Statements
This press release contains forward-looking statements which are found in various places throughout the press release. While these forward-looking statements represent our judgments and future expectations concerning the development of our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to, those listed or discussed in Kulicke & Soffa Industries' 2002 Annual Report on Form 10-K and: the risk of failure to successfully manage our operations; the risk that anticipated orders may not materialize or that orders received may be postponed or canceled, generally without charges; the risk that anticipated cost savings will not be achieved; the volatility in the demand for semiconductors and our products and services; acts of terrorism and violence; overall global economic conditions; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with a substantial foreign customer and supplier base and substantial foreign manufacturing operations; potential instability in foreign capital markets; and other key factors that could adversely affect our businesses and financial performance contained in past and future filings and reports, including those with the SEC. Kulicke & Soffa Industries is under no obligation to (and expressly disclaims any obligation to) update or alter its forward-looking statements whether as a result of new information, future events or otherwise. |
