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Technology Stocks : Semi Equipment Analysis

SOXX 342.47

+1.6%

Jan 16 4:00 PM EST

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To: Gottfried who wrote (10943)	8/11/2003 9:25:36 PM
From: StanX Long	Read Replies (2) of 95738

Gottfried, while researching for a replacement component for one that is being obsoleted, I found the following. It is a "complete list" (maybe) of the technology changes, wafer size and layers. I thought it was interesting and maybe helpful to some of you. IC Knowledge – 2003 IC Cost Model Process List icknowledge.com As of January 5, 2003, the following processes are included in the 2003 IC Cost Model. The syntax is wafer size (mm) – linewidth (µm or nm) – process type – number of polysilicon layers – number and type of metal layers. 100mm - 3.0µm - Bipolar - 2 layer aluminum 100mm - 2.0µm - NMOS - 1 layer poly - 2 layer aluminum 100mm - 2.0µm - CMOS - 1 layer poly - 2 layer aluminum 125mm - 2.0µm - CMOS - 1 layer poly - 2 layer aluminum 150mm - 2.0µm - CMOS logic - 1 layer poly - 2 layer aluminum 150mm - 1.2µm - CMOS logic - 1 layer poly - 2 layer aluminum 150mm - 800nm - CMOS logic - 1 layer poly - 2 layer aluminum 150mm - 800nm - CMOS logic - 1 layer poly - 3 layer aluminum 150mm - 700nm - 30V BICMOS - 1 layer poly - 2 layer aluminum 150mm - 700nm - 30V BICMOS - 2 layer poly - 2 layer aluminum 150mm - 700nm - 60V BICMOS - 2 layer poly - 2 layer aluminum 150mm - 700nm - 100V BICMOS - 2 layer poly - 2 layer aluminum 200mm - 800nm - CMOS logic - 1 layer poly - 2 layer aluminum 200mm - 800nm - CMOS logic - 1 layer poly - 3 layer aluminum 200mm - 500nm - CMOS logic - 1 layer poly - 2 layer aluminum 200mm - 500nm - CMOS logic - 1 layer poly - 3 layer aluminum 200mm - 500nm - CMOS logic - 1 layer poly - 4 layer aluminum 200mm - 350nm - CMOS logic - 1 layer poly - 4 layer aluminum 200mm - 350nm - CMOS logic - 1 layer poly - 5 layer aluminum 200mm - 350nm - CMOS logic - 1 layer poly - 6 layer aluminum 200mm - 350nm - BiCMOS logic - 1 layer poly - 4 layer aluminum 200mm - 350nm - BiCMOS logic - 1 layer poly - 5 layer aluminum 200mm - 350nm - BiCMOS logic - 1 layer poly - 6 layer aluminum 200mm - 300nm to 350nm - SRAM - 2 layer poly - 2 layer aluminum 200mm - 300nm to 350nm - SRAM - 4 layer poly - 2 layer aluminum 200mm - 350nm - Flash - 2 layer poly - 1 layer aluminum 200mm - 350nm - Flash - 3 layer poly - 1 layer aluminum 200mm - 350nm - DRAM - 4 layer poly - 2 layer aluminum 200mm - 250nm - CMOS logic - 1 layer poly - 4 layer aluminum 200mm - 250nm - CMOS logic - 1 layer poly - 5 layer aluminum 200mm - 250nm - CMOS logic - 1 layer poly - 6 layer aluminum 200mm - 250nm - SiGe - 2 layer poly - 3 layer aluminum 200mm - 250nm - SRAM - 5 layer poly - 3 layer aluminum 200mm - 250nm - Flash - 2 layer poly - 2 layer aluminum 200mm - 250nm - Flash - 3 layer poly - 2 layer aluminum 200mm - 250nm - Flash - 2 layer poly - 3 layer aluminum 200mm - 250nm - DRAM - 4 layer poly - 2 layer aluminum 200mm - 180nm - CMOS logic - 1 layer poly - 5 layer aluminum - FSG ILD 200mm - 180nm - CMOS logic - 1 layer poly - 6 layer aluminum - FSG ILD 200mm - 180nm - CMOS logic - 1 layer poly - 6 layer copper 200mm - 180nm - eDRAM - 4 layer poly - 5 layer copper 200mm - 180nm - eDRAM - 4 layer poly - 6 layer copper 200mm - 180nm - SiGe - 2 layer poly - 4 layer copper 200mm - 180nm - SiGe - 2 layer poly - 5 layer copper 200mm - 180nm - SiGe - 2 layer poly - 6 layer copper 200mm - 180nm - SRAM - 5 layer poly - 3 layer aluminum 200mm - 180nm - Flash - 2 layer poly - 3 layer aluminum 200mm - 180nm - DRAM - 4 layer poly - 3 layer aluminum 200mm - 150nm - NAND Flash - 4 layer poly - 2 layer aluminum 200mm - 150nm - DRAM - 4 layer poly - 3 layer aluminum 200mm - 130nm - CMOS logic - 1 layer poly - 6 layer aluminum - FSG ILD 200mm - 130nm - CMOS logic - 1 layer poly - 7 layer aluminum - FSG ILD 200mm - 130nm - CMOS logic - 1 layer poly - 8 layer aluminum - FSG ILD 200mm - 130nm - CMOS logic - 1 layer poly - 6 layer copper - FSG ILD 200mm - 130nm - CMOS logic - 1 layer poly - 7 layer copper - FSG ILD 200mm - 130nm - CMOS logic - 1 layer poly - 8 layer copper - FSG ILD 200mm - 130nm - CMOS logic on SOI - 1 layer poly - 7 layer copper - FSG ILD 200mm - 130nm - CMOS logic - 1 layer poly - 7 layer copper - SiLK ILD 200mm - 130nm - CMOS logic - 1 layer poly - 8 layer copper - SiLK ILD 200mm - 130nm - NOR Flash - 2 layer poly - 3 layer aluminum 200mm - 130nm - NAND Flash - 4 layer poly - 2 layer aluminum 200mm - 130nm - DRAM - 4 layer poly - 3 layer aluminum 200mm - 110nm - DRAM - 4 layer poly - 3 layer aluminum 200mm - Flip Chip Bump - electroplated 200mm - SiMOX 200mm - 90nm - CMOS logic - 1 layer poly - 7 layer copper - low-k ILD 200mm - 90nm - CMOS logic - 1 layer poly - 8 layer copper - low-k ILD 200mm - 90nm - CMOS logic on SOI - 1 layer poly - 7 layer copper - low-k ILD 200mm - 90nm - CMOS logic on SOI - 1 layer poly - 8 layer copper - low-k ILD 200mm - 90nm - DRAM - 4 layer poly - 3 layer aluminum 300mm - 130nm - CMOS logic - 1 layer poly - 6 layer copper - low-k ILD 300mm - 130nm - DRAM - 4 layer poly - 3 layer aluminum 300mm - Flip Chip Bump - electroplated 300mm - SiMOX 300mm - 90nm - CMOS logic - 1 layer poly - 7 layer copper - low-k ILD 300mm - 90nm - CMOS logic - 1 layer poly - 8 layer copper - low-k ILD 300mm - 90nm - CMOS logic on SOI - 1 layer poly - 7 layer copper - low-k ILD 300mm - 90nm - CMOS logic on SOI - 1 layer poly - 8 layer copper - low-k ILD 300mm - 90nm - DRAM - 4 layer poly - 3 layer aluminum

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