SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Strategies & Market Trends : Booms, Busts, and Recoveries

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: smolejv@gmx.net who wrote (37347)8/21/2003 4:18:21 AM
From: maceng2  Read Replies (1) of 74559
 
re chips.

Just having a round chip instead of a square one is an interesting idea all by itself. You can put all the power consuming circuitry towards the outer edge where heat dissipation would be better. The crystal substrate will stay in single crystal form easier then for a square die. None of this silly "ramping" idea of temperatures up to 1200 deg C, you will be able you whang those 1 inch babies up to temperature in 5 seconds just like the old days. Cost per finished die is where it is at. That plus advanced technology.

The usual reason for having bigger wafers "the edge effect" where you get lots more complete die made per manufacturing stage does not come into it. One wafer one die.

Optical focus, uniformity, loads of things happen in circles man not squares.

Don't think like a square!

-lol-
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext