KLA-Tencor debuts long-awaited metrology tool
By Silicon Strategies
09/11/2003 8:45 PM EST
URL: siliconstrategies.com
SAN JOSE -- As expected, KLA-Tencor Corp. late Thursday (Sept. 11, 2003) formally introduced an inline, non-contact metal films metrology tool, based on electron-beam technology.
The new tool, dubbed the MetriX 100, has been expected for months and is aimed to compete against the leader in this market--Rudolph Technologies Inc. ( see Sept. 9 story ).
The MetriX 100 is an ideal tool for production line monitoring at the 90-nm node and process development for the 65-nm and below nodes.
MetriX 100 uses an electron-beam technology, coupled with proprietary high-resolution x-ray detectors and software algorithms, to provide precision and repeatability to within one percent, one sigma, according to the San Jose-based company.
This allows the tool to be used for a wide range of applications, from process development and characterization of ultra-thin atomic layer deposition (ALD) barrier films to routine production monitoring of copper barrier/seed and other yield-limiting critical layers such as silicon oxynitride (SiON) gate dielectrics.
"With MetriX 100, our customers have the ability to bring new, unproven materials successfully into production," said Sergio Edelstein, vice president and general manager of KLA-Tencor's Films and Surface Metrology Division, in a statement.
"After a thorough evaluation, we selected our e-beam-based technology for the MetriX 100 system because it addresses an emerging and critical need for monitoring film composition in 90-nm IC production and is extendible to the 65-nm node and beyond," he said.
MetriX 100 is currently undergoing beta testing at multiple leading-edge IC manufacturing facilities. |
