Kulicke & Soffa Appoints Brian Bachman to Its Board of Directors
Thursday October 16, 9:37 am ET
WILLOW GROVE, PA--(MARKET WIRE)--Oct 16, 2003 -- Kulicke & Soffa Industries, Inc. (NasdaqNM:KLIC - News) today announced that Brian Bachman is joining its Board of Directors. Mr. Bachman will bring his top-level experience to Kulicke & Soffa as the former Chief Executive Officer of Axcelis Technologies, a semiconductor equipment provider of ion implantation equipment. In April 2000, Mr. Bachman led the spin-off of Axcelis Technologies from Eaton Corporation. At Eaton he oversaw the development of the Axcelis management team and product portfolio.
"Brian will provide a well-rounded knowledge base from the semiconductor sector to the K&S board of directors. He brings his experience from Axcelis as well as his management roles in the semiconductor divisions of several global corporations. His background and track record at these companies as (both) a supplier and a user of production equipment clearly matches our requirements for a senior executive team member," said Scott Kulicke, chairman and chief executive officer of Kulicke and Soffa. "Brian will be a welcome addition to our board."
Prior to the CEO position at Axcelis Technologies, Mr. Bachman had been the Senior Vice President and Group Executive -- Hydraulics, Semiconductor Equipment and Specialty Systems of Eaton Corporation from 1996 to 2000. Prior to Eaton, Mr. Bachman was Vice President and Group General Manager of Philips Semiconductor from 1991 to 1995. He also held senior management positions at Square D's semiconductor subsidiary, TRW, General Electric's semiconductor business, Siemens Semiconductor, and ITT Corporation's connector businesses. Mr. Bachman holds a BS in Engineering from the University of Illinois and an MBA from the University of Chicago. He is currently an adjunct professor for the Northwestern University Kellogg-McCormick MMM Program.
About Kulicke & Soffa
Kulicke & Soffa (NasdaqNM:KLIC - News) is the world's leading supplier of wire bonding equipment in the semiconductor assembly market. K&S is the only equipment supplier that also develops and manufactures the products that touch a semiconductor chip's wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip's package. These products include: test probes; bonding wire; and capillaries, which provide an all-inclusive interconnect process when used with the company's wire bonding equipment. In addition, the company offers Flip Chip wafer bumping services and technology. Chip scale and wafer level packaging solutions include Ultra CSP® technology. Test interconnect products include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, as well as test sockets and contactors for all types of packages. Kulicke & Soffa's Web site address is kns.com.
Contact:
Michael Sheaffer
Kulicke & Soffa Industries, Inc.
+1-215-784-6411
msheaffer@kns.com
Source: Kulicke & Soffa Industries, Inc. |
