Back end business seems to be looking up...
Packaging and testing companies release equipment orders
Amy Lee, Taichung; Wen-Yu Lang, DigiTimes [Monday 20 October 2003]
In view of rising demand and high utilization rates, many Taiwanese packaging and testing companies have purchased new equipment in recent months, sources said.
Since late August, Advanced Semiconductor Engineering (ASE) has acquired over 600 wire bonders, including 300 ordered last year. Siliconware Precision Industries Ltd. (SPIL) has also purchased over 300 wire bonder machines during the same period, sources said.
Sources at equipment suppliers said their companies have enjoyed strong sales not only from major clients like ASE and SPIL, but also from many second-tier players.
ChipMOS Technologies said that it has purchased five new T5585 memory-testing machines from Advantest. According to sources, the company also expects to order almost 40 wire bonders from a single equipment supplier.
Powertech Technology, which focuses on memory testing and packaging, has also ordered several T5585 machines from Advantest, and has purchased some second-hand testing machines, according to sources.
Lingsen Precision Industries, Taiwan IC Packaging (TICP) and the testing factory of Royal Philips Electronics in Kaohsiung, Taiwan are all planning to purchase wire bonders this year. While Lingsen said it expects to order 80 bonder machines, the other two are reportedly planning to each order a minimum of 30-40 bonders in the near future, with the maximum likely to reach over 100, sources said.
International Semiconductor Technology (IST), aiming at driver IC testing and packaging, and Greatek Electronics, which focuses on the consumer electronics market, are also considering buying new packaging and testing equipment, according to sources. |
