Kulicke & Soffa forms discrete alliance with Nidec Tosok
Peter Clarke
11/11/2003 12:24 PM EST
URL: siliconstrategies.com
WILLOW GROVE, PA -- Semiconductor assembly and test equipment provider Kulicke & Soffa Industries Inc. said Monday (November 10, 2003) that it has agreed to combine products and technologies in the area of reel-to-reel packaging of discreet devices with Nidec Tosok Corp. of Zama City, Japan.
The alliance with Nidec Tosok extends the market potential for the Nu-Tek wire bonder by adding a configuration of Nu-Tek for reel-to-reel discrete packages, the company said.
Nidec Tosok is a leading supplier of die bonding equipment for the processing of discrete devices, including LEDs, transistors and other small electronic devices. The company has particular expertise in very high-speed, reel-to-reel processing of these components, and consistently delivers the fastest and most precise machines for this purpose throughout the world.
Kulicke & Soffa and Nidec Tosok Corp. first established a relationship in 1965 with a technical agreement, and have continued to partner on various projects throughout the years. K&S has now agreed to manufacture a configuration of its NuTek wire bonder exclusively for Nidec Tosok.
Tosok intends to mate the reel-to-reel Nu-Tek with its own die bonder in various custom configurations to meet customers' specific needs and to provide complete integrated solutions. The result should be a system capable of processing more than 22,000 devices per hour.
Tosok is set to sell, market and service these integrated die-attach, wire bonding machines. |
