ASML updates lithography roadmap, adds immersion
By Peter Clarke
Silicon Strategies
11/13/2003, 10:03 AM ET
LONDON -- ASML Holding NV updated it's lithography roadmap Thursday (November 13, 2003) at a financial analysts' day held in Veldhoven, The Netherlands, adding 193-nm and 157-nm wavelength immersion lithography to spectrum of possibilities.
However in a roadmap chart, found within a presentation put together by Martin van den Brink, executive vice president of marketing and technology at ASML, a decision point for low NA (NA = 0.85) 193-nm immersion lithography is still being shown as being in the fourth quarter of 2003 for equipment that would ship in the fourth quarter of 2004.
A second decision point was marked for mid-2004 against dry 157-nm lithography with NA greater than 0.85, 157-nm immersion lithography with an NA greater of 1, and 193-nm immersion lithography in systems with an NA greater than 1. All three types of system would be expected to ship to customers from the second quarter of 2006, the presentation shows.
The road-map chart does show the Twinscan AT:1150i as a prototype immersion lithography machine.
Van den Brink concluded that low k1 and immersion were likely to extend 193-nm wavelength lithography. "Immersion will likely become a 193-nm extension pushing 157-nm and EUV backwards. Qualified customer integration is expected at the end of 2004," he said.
Van den Brink's and other presentations from the ASML financial analysts' meeting could be found here when this story was first posted. |
