Novellus debuts copper plating tool for 65-, 45-nm ICs
By Mark LaPedus
Silicon Strategies
12/01/2003, 4:05 PM ET
SAN JOSE--Enabling a new round of copper-based devices, Novellus Systems Inc. today (December 1, 2003) rolled out its next-generation electrochemical plating (ECP) tool for use in 65- and 45-nm chip designs.
Novellus' new Sabre Next Electrofill tool is a 200/300-mm system, which makes use of two new chemistries in order to extend its single-step, one-bath technology. Compared to current ECP tools in the marketplace, the Sabre Next is said to increase throughput by up to 15 percent, cuts chemical costs by more than 30 percent, and reduces process by-products by 70 percent, according to the San Jose-based chip equipment maker.
Throughputs of up to 75 wafers per hour (wph) for 200-mm substrates and 70 wph for 300-mm products can be achieved with the new machine. The Sabre Next is geared to tackle the complex requirements of copper/low-k interconnects in current and future chip designs, said Tim Archer, vice president and general manager of Novellus' Electrofill Products Business Unit, based in Tualatin, Oregon.
The new system addresses several critical issues in chip production. The electroplating process step is an enabling technology for the subsequent and sometimes challenging chemical mechanical planarization (CMP) process. And as device geometries continue to shrink, copper electroplating faces a number of new challenges, such as void-free filling of narrow and deep features, plating on thin seed layers, and reducing plating defects.
The Sabre Next has been specifically designed to tackle these emerging needs, according to Archer. The tool makes use of new organic additives and chemistries to enable "faster fill rates," he said. "CMP integration is somewhat easier (with the Sabre Next)," he said in an interview with Silicon Strategies..
The Sabre Next is the company's third-generation ECP tool. Novellus claims to be the leader in this market with more than 150 systems installed worldwide. Applied Materials Inc., NuTool Inc., and others compete in the ECP market, which is expected to grow from $160 million in 2002, to $550 million by 2006, according to analysts.
Novellus archrival--Applied--earlier this year moved to shake up the market by rolling out its latest ECP tool. Applied's SlimCell tool breaks away from the traditional "batch chemistry" and "bleed and feed" approaches from Novellus and others in the market. Applied's tool makes use of multi-step ECP processing, which consists of four independent "cells" or chambers that are linked to four smaller "cell-independent baths" (see June 18 story).
At the time of Applied's announcement, some analysts feared that the chip-equipment giant would take significant market share away from rival Novellus. Some analysts believe those fears have been overstated, as Novellus continues to dominate the marketplace, analyst said.
There appears to be room in the market for several competitors, especially as more chip makers migrate towards copper-enabled designs. At present, only a small percentage of chips are manufactured with copper. "In the next couple of years, we expect to see huge ramps of copper," Archer said.
Meanwhile, compared to Applied's tool, Novellus takes more of a conventional batch and "bleed and feed" approach to what the company calls ElectroFill processing. The company's tool processes wafers via three "cells" or chambers, which are linked to a common, large bath.
Novellus has also added two new chemistries to the mix for 65- and 45-nm designs. Dubbed Viaform NexT and Ultrafill NexT, the chemistries have demonstrated bottom-up fill with minimal overplating in a single-step, one-bath process, according to Novellus. Meanwhile, the tool also includes a secondary bath module for R&D. This allows for qualification of new chemistries without impacting production.
At the core of the system is a proprietary single-step chemistry that provides reproducible fill at advanced nodes, with reduced defects and an optimal profile for CMP. In addition, a new anode cell design capitalizes on continuing developments in plating chemistry technology, reducing the level of contaminants in the plating bath, while dramatically cutting chemical consumption, according to the company.
It also includes what the company calls a modular clamshell, which is a pressure assist open/close mechanism. The modularity of the clamshell not only makes it easier to service, but it also reduces the requirement for preventive maintenance from four times a year to once a year, the company said.
Japan's Sony Corp. is among the first companies to place an order for the new Novellus tool, with the system destined for the company's facility in Atsugi, Japan. The Sabre Next will be used for the development of eDRAM and advanced devices at the 45-nm technology node and beyond. Shipment of the system is expected to occur in the first quarter of 2004. |
