Mattson Technology Equips Trecenti Technologies' 300 mm Fab
Monday December 15, 8:30 am ET
Aspen III 300 mm Strip System Used for Advanced 130 nm Logic Devices
FREMONT, Calif., Dec. 15 /PRNewswire-FirstCall/ -- Mattson Technology, Inc. (Nasdaq: MTSN - News), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has installed its 300 mm Aspen III ICP Strip at Trecenti Technologies' 300 mm chip manufacturing facility in Hitachinaka, Japan, where several Aspen III systems are already installed. The Aspen III Strip system is being used for the production of Trecenti's most advanced 130 nm logic devices.
"Our decision to continue selecting Mattson Technology underscores our confidence in the advanced technology and production worthiness of its systems," said Dr. Atsuyoshi Koike, president and chief executive officer of Trecenti Technologies. "The Aspen III ICP Strip 300 mm system continues to meet our production requirements for resist strip and residue removal in the back-end-of-line processing and provides the performance and productivity we need to deliver leading-edge devices to our customers."
"Trecenti is one of the premier 300 mm manufacturing fabs in the global semiconductor community," said Mike Morita, Mattson Technology's vice president of U.S., Europe and Japan operations. "Having Trecenti again choose our Aspen III Strip system for its 130 nm device production demonstrates the success of the system in high-volume, cost-critical manufacturing and reinforces our 300 mm market leadership. We look forward to continue supporting our customers in realizing the economic benefits of 300 mm production."
About the Aspen III Strip
The Aspen III Strip system features Mattson Technology's proprietary inductively coupled plasma (ICP) source that effectively strips the resist and residue, reducing the need for post-strip chemical processing. The system achieves excellent results for high-dose implant strip, residue removal and surface cleaning for advanced applications, including low-k and oxygen and non-oxygen-based processes. The Aspen III Strip system offers advanced technology on a high-throughput platform, providing process performance and low cost of ownership advantages to chipmakers for advanced device manufacturing.
About Mattson Technology, Inc.
Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company's core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538.
Telephone: 800-MATTSON/510-657-5900. Fax: 510-492-5911. Internet:
www.mattson.com.
Mattson Technology Contact
Lauren Vu
PR Manager
Mattson Technology, Inc.
tel 510-492-6518
fax 510-492-2800
lauren.vu@mattson.com
Source: Mattson Technology, Inc. |
