ASML, Canon, Nikon vie for AMD's 300-mm litho biz (Updated)
Mark LaPedus
02/09/2004 10:50 AM EST
URL: siliconstrategies.com
SUNNYVALE, Calif.--ASML Holding NV, Canon Inc., and Nikon Corp. are competing for a major 300-mm, lithography-tool order at Advanced Micro Devices Inc.'s proposed fab in Germany, according to officials from the supplier of microprocessors and flash memory devices.
AMD is also evaluating immersion lithography tools from various vendors, which could be inserted in the later part of the 65-nm node, said David Bennett, director of strategic equipment technology and alliances for the Sunnyvale-based chip maker.
Bennett said AMD has yet to order an immersion tool, but he dropped hints that the technology could eliminate 157-nm lithography, perhaps even from the company's own roadmap. "Immersion may be the death of 157-nm," he said in an interview with Silicon Strategies..
(Editors note: Originally, Silicon Strategies reported that Bennett said immersion is the death of 157-nm lithography. Silicon Strategies reported this in error and Bennett said immersion may be the death of 157-nm lithography.)
Initially, AMD is looking to order an unclosed number of "dry" 193-nm lithography tools for its 300-mm wafer fab, which is under construction in Dresden, Germany. The fab will be used to make next-generation processors. In November, AMD broke ground on a manufacturing facility for 300-mm diameter wafers, named Fab 36, in Dresden. The fab, to cost $2.4 billion, is a 65- to 45-nm plant that is expected to move into production in 2006 (see November 20, 2003 story).
The leading contenders for the lithography order at AMD's Dresden fab are ASML, Canon, and Nikon, although no decision has been reached, according to Bennett. "We are looking at all vendors," he said.
At present, AMD basically uses two lithography vendors for the critical layers for its chip designs--ASML of the Netherlands and Canon of Japan. Generally, the chip maker has a large installed base of ASML's 248- and 193-nm lithography tools, which are used to process the wafers for its microprocessors, he said.
The main lithography vendor for its flash-memory business is Canon, he said. AMD and Fujitsu Ltd. have a joint flash-memory venture, dubbed FASL LLC, and Canon is the primary scanner vendor in that operation, he said.
Some observers believe the final decision for the lithography order may come down to both AMD and its technology partner, IBM Corp. IBM and AMD have a joint technology deal to devise process technology for the 65-nm and 45-nm nodes on 300-mm substrates.
Bennett indicated that AMD may "align" its tool choices with IBM, which could reportedly benefit at least one vendor--ASML. Sources believe that IBM mainly uses ASML's 193-nm scanners within its new 300-mm fab in East Fishkill, N.Y.
"Relative alignment with the development tool set is one of those considerations," he said.
ASML is not a slam-dunk to win the business within AMD's Dresden plant, however. "Cost is a major component," Bennett said.
Indeed, analysts believe that ASML's 193-nm tools cost $12-to-$20 million each. In contrast, tools from Canon and Nikon sell for below that, reportedly $8-to-$15 million, according to analysts.
Tool price is not the only consideration. "We all know that ASML carries a premium on a stepper-by-stepper basis, and for that reason, AMD looks at total cost of ownership to guide its decision and accounts for things like throughput, technical capability and other factors," he said.
Meanwhile, Canon is making inroads as well. Besides being the dominate supplier of scanners to FASL, Canon has also installed a leading-edge tool within an undisclosed development center. The tool is believed to be installed within Advanced Mask Technology Center GmbH & Co. KG (AMTC), a joint photomask venture in Dresden between AMD, Infineon, and DuPont Photomasks. AMTC is developing masks for the 90- and 65-nm nodes.
Nikon is also not out of the running for the business. "Nikon is also way out there with immersion," according to Bennett. Like most leading-edge chip makers, AMD is evaluating immersion lithography and 157-nm despite the problems with latter technology.
"We're looking at all the technologies," he said. "Immersion seems to be far closer for the 65-nm node. (Immersion makes sense) for the latter part of the 65-nm node." |
