More Flash Capacity Ahead
By John Mason -- Electronic News, 2/12/2004
Powerchip Semiconductor Corp. (PSC) will begin mass production of high-density AG-AND flash chips for Renesas Technology next quarter, which is a quarter earlier than its original schedule, according to the Taipei Computer Association.
With this influx of chips, Renesas expects to double its wafer production delivering about 10,000 12-inch wafers per month. Under the agreement, PSC will produce 1Gbit AG-AND flash at its Fab 12A, with 0.13-micron process technology support from Renesas.
In anticipation of its increased supply of chips from PSC, Renesas reportedly has spent $307.6 million to boost its subsidiary Trecenti Technologies’ capacity to produce 12,000 12-inch wafers.
Meanwhile, PSC is considering allotting some 12-inch capacity to foundry services, according to PSC president Brian Hsieh. Eric Tang, spokesman for PSC, said his company will do this only after exploring the possibility with its customers.
It is rumored that the Taiwan-based memory maker is likely to begin using its 12-inch fab for foundry business in the very near future, due to surging SDRAM foundry orders for SDRAM chips-low density ones in particular, which are used in consumer electronic devices. PSC's 8-inch fab already allocates 50 percent capacity to foundry services.
John Mason is a contributing editor to Electronic News. Mason is based in Spain. |
